METHOD FOR MANUFACTURING SURFACE-MODIFIED THERMOPLASTIC RESIN, METHOD FOR MANUFACTURING BONDED STRUCTURE, BONDED STRUCTURE, THERMAL TRANSFER SURFACE-MODIFIED SHEET, THERMOPLASTIC RESIN WITH THERMAL TRANSFER SURFACE-MODIFIED SHEET, AND SURFACE-MODIFIED THERMOPLASTIC RESIN

Title:

Document Type and Number:

WIPO Patent Application WO/2017/122797

Kind Code:

A1

Abstract:

Provided is a method for manufacturing a surface-modified thermoplastic resin, being a thermoplastic resin to which sufficient adhesive strength is imparted. Further provided is a method for manufacturing a bonded structure, in which a surface-modified thermoplastic resin obtained via the aforementioned manufacturing method is laminated to an adherend via an adhesive layer, and which can exhibit sufficient adhesive strength. Further provided is a bonded structure that can exhibit sufficient adhesive strength. Further provided is a thermal transfer surface-modified sheet that can preferably be used in the method for manufacturing a surface-modified thermoplastic resin. Further provided is a thermoplastic resin with a thermal transfer surface-modified sheet, said thermoplastic resin having the aforementioned thermal transfer surface-modified sheet. Further provided is a surface-modified thermoplastic resin, being a thermoplastic resin to which a sufficient adhesive strength is imparted. In the method for manufacturing a surface-modified thermoplastic resin, in which an easily adhesive layer is laminated onto a thermoplastic resin having a melting point of T°C, the easily adhesive layer is provided to at least a portion of the surface of the thermoplastic resin, and heat-welding is carried out at a temperature of at least (T-50)°C.

Inventors:

OKADA KENICHI (JP)
SHIMOKITA KEISUKE (JP)
TANAKA AKIKO (JP)
FUNATSU ERIKO (JP)
GOMI ASUKA (JP)
SHIMAZU AKIRA (JP)

Application Number:

PCT/JP2017/001066

Publication Date:

July 20, 2017

Filing Date:

January 13, 2017

Export Citation:

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Assignee:

NITTO DENKO CORP (JP)

International Classes:

B29C65/48; B32B27/00; C08J7/043; C09J7/02; C09J201/00

Domestic Patent References:

WO2008075461A1

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