Title:
METHOD FOR MANUFACTURING THREE-DIMENSIONAL MOLDING WITH MICROSTRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/119398
Kind Code:
A1
Abstract:
The present invention provides a method for manufacturing a three-dimensional molding with a microstructure with which there is little risk of deforming the microstructure. This method comprises a forming step (S7) for forming resin film (5) with a microstructure to produce a three-dimensional molding (10) with a microstructure. The resin film (5) with a microstructure is provided with a main film body (4) that has a thickness of 0.03 mm to 1 mm and is prepared from a thermoplastic resin, and a microstructure layer (3) covering the main film body (4). The microstructure layer (3) is prepared from a thermosetting resin.
Inventors:
NAGASAWA ATSUSHI (JP)
HAMASHIMA ISAO (JP)
HAMASHIMA ISAO (JP)
Application Number:
PCT/JP2016/089126
Publication Date:
July 13, 2017
Filing Date:
December 28, 2016
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
B29C51/10; B29C51/02; B32B3/30; B32B27/16; G02B3/00; G02B3/06; G02B3/08
Domestic Patent References:
| WO2014069535A1 | 2014-05-08 |
Foreign References:
| JP2013226667A | 2013-11-07 | |||
| JP2012081619A | 2012-04-26 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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