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Title:
METHOD FOR MANUFACTURING TIN-PLATED COPPER TERMINAL MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/104682
Kind Code:
A1
Abstract:
The present invention is a method for manufacturing a tin-plated copper terminal material, which uses a copper or copper alloy substrate, for terminals to be pressure welded on the ends of electric wires made of aluminum wire and which is not susceptible to electric erosion and has excellent tin layer adhesiveness. The method comprises: a zinc nickel alloy layer-forming step for forming a zinc nickel alloy layer, in which the nickel content is 5 mass% to 50 mass%, on a substrate made of copper or copper alloy at a thickness of 0.1 µm to 5.0 µm; and a tin-plating step for forming a tin layer by performing tin-plating on the zinc nickel alloy layer. More preferably, after the tin-plating step, the method also comprises a diffusion step for diffusing the zinc of the zinc nickel alloy layer into the tin layer by maintaining at 40°C to 160°C for at least 30 minutes.

Inventors:
KUBOTA, Kenji (Central Research Institute 1002-14, Mukohyama, Naka-sh, Ibaraki 02, 〒3110102, JP)
TARUTANI, Yoshie (Central Research Institute 1002-14, Mukohyama, Naka-sh, Ibaraki 02, 〒3110102, JP)
NAKAYA, Kiyotaka (Central Research Institute 1002-14, Mukohyama, Naka-sh, Ibaraki 02, 〒3110102, JP)
Application Number:
JP2016/087137
Publication Date:
June 22, 2017
Filing Date:
December 14, 2016
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORPORATION (3-2 Otemachi 1-chome, Chiyoda-ku Tokyo, 17, 〒1008117, JP)
International Classes:
C25D5/12; C22C18/00; C23C10/28; C25D5/50; C25D7/00; H01B13/00
Domestic Patent References:
WO2013161125A12013-10-31
Foreign References:
JP2000169996A2000-06-20
JP2000144482A2000-05-26
JP2003328157A2003-11-19
JPH0841681A1996-02-13
JPH11193494A1999-07-21
JP2014164927A2014-09-08
Attorney, Agent or Firm:
AOYAMA, Masakazu (Seiyo Patent Office, 3F Shin-Chiyoda Kyodo Bldg. 3-3-9, Kandakajicho, Chiyoda-k, Tokyo 45, 〒1010045, JP)
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