Title:
METHOD OF MANUFACTURING TITANIUM-CONTAINING SPUTTERING TARGET
Document Type and Number:
WIPO Patent Application WO/2011/052171
Kind Code:
A1
Abstract:
Disclosed is a method of producing titanium-containing sputtering targets such that the number of abnormal discharges caused by lattice defects is reduced. A first metallic powder containing a high melting point metal, and a second metallic powder containing titanium are produced. Subsequently, a powder mixture of the first and second metallic powders is sintered at 695°C or above, and then heat-treated at 685°C or below. By heat-treating the sintered body at 685°C or below after sintering, plate-like structures (lattice defects) in the sintered phase are reduced. In this way, a titanium-containing sputtering target can be obtained in which fewer abnormal discharges occur.
Inventors:
TAKAHASHI KAZUTOSHI (JP)
NITTA JUNICHI (JP)
NITTA JUNICHI (JP)
Application Number:
PCT/JP2010/006262
Publication Date:
May 05, 2011
Filing Date:
October 22, 2010
Export Citation:
Assignee:
ULVAC INC (JP)
TAKAHASHI KAZUTOSHI (JP)
NITTA JUNICHI (JP)
TAKAHASHI KAZUTOSHI (JP)
NITTA JUNICHI (JP)
International Classes:
C23C14/34; B22F1/00; H01L21/28; H01L21/285; B22F9/08; B22F9/22
Foreign References:
| JPH06507674A | 1994-09-01 | |||
| JP2007297654A | 2007-11-15 | |||
| JP2006028536A | 2006-02-02 | |||
| JP2008255440A | 2008-10-23 | |||
| JPH04308082A | 1992-10-30 | |||
| JPH0610126A | 1994-01-18 | |||
| JPH04193947A | 1992-07-14 | |||
| JPH0598435A | 1993-04-20 |
Attorney, Agent or Firm:
OMORI, JUNICHI (JP)
Omori Junichi (JP)
Omori Junichi (JP)
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