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Title:
METHOD FOR MANUFACTURING TRANSPARENT REINFORCED ASSEMBLY LAYER AND METHOD FOR MANUFACTURING FINGERPRINT SENSOR ASSEMBLY USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/097579
Kind Code:
A1
Abstract:
An embodiment of the present invention provides a method for manufacturing a transparent reinforced assembly layer, which has a simplified manufacturing process and improved production efficiency, and a method for manufacturing a fingerprint sensor assembly using the same. The method for manufacturing a transparent reinforced assembly layer comprises the steps of: a) arranging a color layer on one surface of a first release film; b) arranging a transparent reinforced monolayer on one surface of the color layer, the transparent reinforced monolayer being formed by synthesizing organic/inorganic composite compound materials, and arranging a second release film on one surface of the transparent reinforced layer; and c) removing the first release film and arranging an adhesive layer on the other surface of the color layer, wherein the transparent reinforced assembly layer is provided on the upper surface of an encapsulating portion of a fingerprint sensor assembly comprising: a base substrate; a plurality of sensor portions arranged on the upper surface of the base substrate; bonding wires electrically connecting the sensor portions to the base substrate, respectively; and the encapsulating portion, provided on the upper surface of the base substrate, for encapsulating the plurality of sensor portions and the plurality of bonding wires.

Inventors:
PARK JI HO (KR)
KIM HUN RAE (KR)
KIM DONG SEL (KR)
Application Number:
PCT/KR2017/013304
Publication Date:
May 31, 2018
Filing Date:
November 21, 2017
Export Citation:
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Assignee:
GAEMA TECH CO LTD (KR)
International Classes:
G06K9/00; C09J7/00
Foreign References:
KR20150131829A2015-11-25
KR20160084302A2016-07-13
JP2007012040A2007-01-18
KR20140123919A2014-10-23
KR20130111464A2013-10-10
Attorney, Agent or Firm:
HAN, Sang Soo (KR)
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