Title:
METHOD FOR MANUFACTURING ULTRASONIC TRANSDUCER, ULTRASONIC TRANSDUCER AND RANGEFINDER
Document Type and Number:
WIPO Patent Application WO/2023/131986
Kind Code:
A1
Abstract:
A method for manufacturing an ultrasonic transducer (100) comprises the following steps. A first SOI substrate including: a first silicon film (111); a second silicon film (113); and an intermediate silicon oxide film (112) sandwiched between the first silicon film (111) and the second silicon film (113) is prepared. A piezoelectric element (107) is formed on the first silicon film (111) of the first SOI substrate. A diaphragm (103) is formed by etching the second silicon film (113). A silicon substrate is connected to the second silicon film (113). An opening (205) and a gap (101) are formed in an acoustic resonance structure (100a) including the first SOI substrate and the silicon substrate so as to amplify oscillating sound waves of the diaphragm (103), and the resonance frequencies of the diaphragm (103) and the acoustic resonance structure (100a) are matched.
Inventors:
HIRATA YOSHIAKI (JP)
KAJIYAMA YOSHITAKA (JP)
KAJIYAMA YOSHITAKA (JP)
Application Number:
PCT/JP2022/000027
Publication Date:
July 13, 2023
Filing Date:
January 04, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H04R17/00; H04R31/00
Foreign References:
| JP2005051689A | 2005-02-24 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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