METHOD FOR MANUFACTURING WAFER LENS AND METHOD FOR MANUFACTURING WAFER LENS LAMINATED BODY

WIPO Patent Application WO/2010/119725

A1

Provided is a method for manufacturing a wafer lens, wherein sink marks and voids are not generated even in a thick portion of a lens section and rapid hardening and shrinkage of the wafer lens can be eliminated. The method is provided with: a dispense step of dropping or applying, between a molding die and one surface of a substrate, a resin material which contains a photocurable resin, a first initiator, which is sensitive with a first wavelength of a predetermined wavelength or shorter and generates radicals with the first wavelength, and a second initiator, which is sensitive with a second wavelength on the side of a longer wavelength than the predetermined wavelength and generates radicals with the second wavelength; an imprint step of pressing the resin material to the molding die or the substrate; a first light radiating step of radiating light through a filter that cuts light of the predetermined wavelength or shorter and promoting curing of the resin material; and a second light radiating step of radiating light to the resin material by removing the filter and further promoting curing.

HARA AKIKO (JP)

PCT/JP2010/052727

October 21, 2010

February 23, 2010

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KONICA MINOLTA OPTO INC (JP)
HARA AKIKO (JP)

B29C39/10; B29C39/44; G02B3/00; B29L11/00

WO2001007938A1

2001-02-01

JP2003291159A	2003-10-14
JP2009212397A	2009-09-17
JP2009066827A	2009-04-02
JP2008158183A	2008-07-10
JP2003329808A	2003-11-19
JPH11245266A	1999-09-14
JP2005138334A	2005-06-02
JPS62280006A	1987-12-04
JPH0971439A	1997-03-18
JP2004258071A	2004-09-16
JP2009266901A	2009-11-12

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