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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING WALL AND FLOOR BOARD USING PLYWOOD
Document Type and Number:
WIPO Patent Application WO/2017/204456
Kind Code:
A1
Abstract:
The present invention relates to a method for manufacturing a floor board using plywood and, more specifically, to a method for manufacturing a wall and floor board using plywood, which can increase a bottom support area of plywood in the course of compressing and molding the plywood, so as to enable a stable supporting force to be secured, so that the method can improve the strength of the board through compression at a uniform density regardless of the kinds of different plywood, and maintain uniform flatness and thickness of the board. Further, the method can realize an excellent flatness and texture with respect to the surface of the board and form grid-shaped unevenness on the bottom surface of the board, so as to achieve smooth application of an adhesive and increase an adhesive force during construction of a board.

Inventors:
LEE, Soon Kwon (29-41, Gahyeon-ro 4beon-gil Tongjin-eup,Gimpo-si, Gyeonggi-do, 10038, KR)
Application Number:
KR2017/003284
Publication Date:
November 30, 2017
Filing Date:
March 28, 2017
Export Citation:
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Assignee:
LEE, Soon Kwon (29-41, Gahyeon-ro 4beon-gil Tongjin-eup,Gimpo-si, Gyeonggi-do, 10038, KR)
International Classes:
B27D3/02; B27M3/04; B32B21/04
Foreign References:
KR20160011355A2016-02-01
KR101007912B12011-01-14
KR20150111593A2015-10-06
KR20050072717A2005-07-12
KR19990065077A
Attorney, Agent or Firm:
CHUNG, Sun Won (VISION INTERNATIONAL #201, Cheongho Building 11-3 Teheran-ro 8-gil,Gangnam-gu, Seoul, 06234, KR)
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