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Title:
METHOD FOR MANUFACTURING A WATERPROOF BUS CONNECTOR AND BUS CONNECTOR WITH OVERMOLDED DEVICE HOUSING
Document Type and Number:
WIPO Patent Application WO/2017/136122
Kind Code:
A1
Abstract:
Embodiments comprise methods of overmolding a device housing (120) to an electrical connector (110) and connector-housing assemblies created from such methods. Overmolding the device housing (120) to the electrical connector (110) may form a waterproof seal between the device housing and one or more elements of the electrical connector. Elements of the electrical connector (110) may be coupled so as to form a waterproof seal between elements. In some embodiments, the electrical connector may be a peripheral bus connector which may comprise, for example, one or more pins (113), an insulating tongue (112), and/or frame (111).

Inventors:
LEDESMA ANDREW (US)
BERDIN REGULUS (PH)
CULIBRA TITO (PH)
OLIVEROS CARLMIL (PH)
UBALDE NESTOR (PH)
Application Number:
PCT/US2017/013443
Publication Date:
August 10, 2017
Filing Date:
January 13, 2017
Export Citation:
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Assignee:
FORTIFY TECH LLC (US)
International Classes:
H01R13/405; H01R43/24; H01R13/504; H01R13/52; H01R24/62; H05K5/00
Domestic Patent References:
WO2009033034A12009-03-12
Foreign References:
US9160098B12015-10-13
Other References:
None
Attorney, Agent or Firm:
GRIFFITH, Jon, B. (US)
Download PDF:
Claims:
CLAIMS

What is claimed is:

1. A method for manufacturing a bus connector, the method comprising:

coupling an insulating tongue to a plurality of pins,

coupling a frame to the insulating tongue; and

overmoldmg a device housing to the insulating tongue,

wherein coupling the insulating tongue to the plurality of pins forms a waterproof seal

between each of the plurality of pins and the insulating tongue: and

wherein overmolding the device housing to the insulating tongue forms a waterproof seal between the device housing and the insulating tongue.

2. The method of claim 1 comprising overmolding the device housing to the frame wherein

overmolding the device housing to the frame forms a waterproof seal between the device housing and the frame.

3. The method of claim 1 in which coupling the frame to the insulating tongue forms a

waterproof seal between the frame and insulating tongue.

4. The method of claim 1 in which coupling the insulating tongue to the plurality of pins

comprises at least one of:

overmolding the insulating tongue to the plurality of pins; or

hot-pressing the pins through the insulating tongue.

5. The method of claim 1 in which coupling the frame to the insulating tongue comprises at least one of:

overmolding the insulating tongue to the frame;

inserting the insulating tongue into the frame; or

wrapping the frame around the insulating tongue,

6. The method of claim 1 comprising overmolding an insulating cover to the insulating tongue and the frame and further comprising oveniiolding the device housing to the insulating cover: wherein overmolding the insulating cover to the insulating tongue forms a waterproof seal between the insulating cover and the insulating tongue,

wherein overmolding the insulating cover to the frame forms a waterproof seal between the insulating cover and the frame; and

wherein overmolding the device housing to the insulating cover forms a waterproof seal between the device housing and waterproof cover.

7. The method of claim 1 in which the bus connector conforms to a USB standard.

8. A bus connector comprising:

a plurality of pins coupled to an insulating tongue,

a frame coupled to the insulating tongue; and

a device housing overmok!ed to the insulating tongue,

wherein contact of the insulating tongue with the plurality of pins forms a waterproof seal between the insulating tongue and each of the plurali ty of pins; and

wherein contact of the device housing with the insulating tongue forms a waterproof seal between the device housing and the insulating tongue.

9. The bus connector of claim 8 in which the device housing is overmok!ed to the frame and contact of the device housing with the frame forms a waterproof seal between the device housing and the frame.

10. The bus connector of claim 8 in which contact of the frame and the insulating tongue form a waterproof seal between the frame and insulating tongue. 1. The bus connector of claim 8 comprising an insulating cover overmolded to the insulating tongue and the frame;

wherein contact of the insulating cover with the insulating tongue forms a waterproof seal between the insulating cover and the insulating tongue;

wherein contact of the insulating cover with the frame forms a waterproof seal between the insulating cover and the frame; and

wherein the device housing contacts the insulating cover forming a waterproof seal between the device housing and the insulating cover.

12. The bus connector of claim 8 in which the bus connector conforms to a USB standard.

13. The bus connector of claim 8 in which the device housing comprises one or more fasteners and the insulating tongue and the frame are recessed below a surface of one of the one or more fasteners.

14. The bus connector of claim 13 in which the one of the one or more fasteners is removably coupled to a mounting and the mounting covers the bus connector when the mounting is coupled to the one of the one or more fasteners.

15. The bus connector of claim 14 in which the mounting is coupled to a means for securing the device housing to a user.

16. A bus connector comprising:

an assembly comprising a plurality of pins coupled to an insulating tongue and a frame coupled to the insulating tongue; and

a device housing overmolded to the assembly,

wherein each of the plurality of pins traverses the device housing from an inner surface of the device housing to an outer surface of the device housing; and

wherein contact of the device housing with the plurality of pins forms a waterproof seal between the device housing and each of the plurality of pins,

17. The bus connector of claim 16 in which the bus connector conforms to a USB standard.

18. The bus connector of claim 16 in which the device housing comprises one or more fasteners and the insulating tongue and the frame are recessed below a surface of one of the one or more fasteners.

19. The bus connector of claim 18 in which the one of the one or more fasteners is removably coupled to a mounting and the mounting covers the bus connector when the mounting is coupled to the one of the one or more fasteners.

20. The bus connector of claim 19 in which the mounting is coupled to a means for securing the device housing to a user.

Description:
METHOD FOR MANUFACTURING A WATERPROOF BUS CONNECTOR AND BUS CONNECTOR WITH OVERMOLDED DEVICE HOUSING

CLAIM OF PRIORITY

This application claims the benefit of U.S. Provisional Application No. 62/291,321 , filed February 4, 2016, the entire contents of which are hereby incorporated by reference.

TECHNICAL FIELD

Embodiments relate to assemblies comprising device housings and waterproof electrical connectors and methods of manufacturing the assemblies using overmolding processes.

BACKGROUND

A great variety of electrical devices require some form of external electrical connection. The connection may provide a device with power or, in the case of computing devices, allow for transfer of data. Many electrical connectors take the form of a plug that is inserted into a socket (also referred to as a receptacle). Many plugs include a plurality of pins. A pin is electrically conductive and separated from other pins by an insulating material. A pin may protrude like a post or may be coupled to a surface allowing contact on one side of the pin. Sockets contain electrically conductive elements that, when receiving a plug, each contact a pin allowing an electrical current to flow from the pin to the socket element with a minimum of electrical flow among pins.

Plugs and sockets are sometimes referred to as the male and female ends of the connection, respectively, but the distinction is not always useful. Male connectors are technically those with pins protruding while female connectors have slots that can surround the male pins. However, the pins of the male connector may be surrounded by a shroud that accepts a female connector within the shroud or be recessed below a surface while the slots of a female connector may be recessed within a protruding plug. To further complicate matters, some connectors form an electrical connection with two metal surfaces that slide against each other, neither clearly protruding. These surfaces are not pins in the traditional sense, but may still be referred to as pins because they facilitate an electrical connection. In these cases, female and male may simply describe which connector surrounds the other. Computer buses are one type of electrical connector used primarily for transferring data, though some additionally serve as power sources. Internal buses serve to cany data from one component to another within a computing device while peripheral buses carry data from one computing device to another. Peripheral buses have come to be standardized both in the shape of the connector and the protocol for data transfer. There are many standards for peripheral buses including Universal Serial Bus (USB), Firewire (IEEE 1394), and Ethernet (IEEE 802.3af).

Injection molding is a process of injecting a molten material into a mold in which the material solidifies. The molten material may, for example, comprise a thermoplastic polymer which liquefies at higher temperatures and solidifies at lower temperatures. Alternatively, the molten material may comprise a thermosetting polymer which forms more permanent bonds upon curing. After the molten material solidifies, the mold is removed leaving an object in the shape of the mold cavity. Overmoiding is a type of injection molding in which a material is molded over an insert and is sometimes referred to as insert molding. The insert is positioned in the mold and molten material is injected around the insert. Unlike the mold, which is separated and removed from the solidified material, the insert is coupled to the solidified material to form a single product. The overmolded material may fuse to the insert at the chemical level or be attached mechanically (e.g. by filling holes or grooves in the insert). The insert may be made of the same material as the overmolded material or the materials may differ. The insert itself may be the product of injection molding. Two-shot injection molding is a process in which the insert is pre-molded, by injection molding, within the moid used for the overmoiding such that both the mold and overmold are added in same machine cycle.

SUMMARY

Embodiments comprise methods of overmoiding a device housing to an electrical connector and connector-housing assemblies created from such methods. Overmoiding the device housing to the electrical connector may form a waterproof seal between the device housing and one or more elements of the electrical connector. Elements of the electrical connector may be coupled so as to form a waterproof seal between elements. In some embodiments, the electrical connector may be a peripheral bus connector which may compri se, for example, one or more pins, an insulating tongue, and/or frame.

BRIEF DESCRIPTION OF THE DRAWINGS

Figures J A - 1C present three transverse cross-sectional diagrams illustrating the position of a pin relative to an insert and overmolded material, according to certain embodiments of the present disclosure.

Figures 2A - 2C present three longitudinal cross-sectional diagrams illustrating the position of a pin relative to an insert and overmolded material, according to certain embodiments of the present disclosure.

Figure 3 presents a wireframe diagram illustrating an embodiment comprising a USB Standard A plug, according to the present disclosure.

Figure 4 presents a pattern fill wireframe diagram illustrating an embodiment comprising a USB Standard A plug, according to the present disclosure.

Figure 5 presents a wireframe diagram illustrating a longitudinal cross-section of an embodiment comprising a USB Standard A plug, according to the present disclosure.

Figure 6 presents a pattern fill wireframe diagram illustrating a longitudinal cross- section of an embodiment comprising a USB Standard A plug, according to the present disclosure.

Figure 7 presents a wireframe diagram illustrating an embodiment comprising a USB Micro B receptacle, according to the present disclosure.

Figure 8 presents a pattern fill wireframe diagram illustrating an embodiment comprising a USB Micro B receptacle, according to the present disclosure.

Figure 9 presents a wireframe diagram illustrating a longitudinal cross-section of an embodiment comprising a USB Micro B receptacle, according to the present disclosure.

Figure 10 presents a pattern fill wireframe diagram illustrating a longitudinal cross- section of an embodiment comprising a USB Micro B receptacle, according to the present disclosure. Figure 11 presents a wireframe diagram illustrating a longitudinal cross-section of an embodiment comprising a USB Micro B receptacle, according to the present disclosure.

Figure 12 presents a wireframe diagram illustrating an embodiment comprising a USB Micro B receptacle recessed within a fastener, according to the present disclosure.

Figure 13 presents a pattern fill wireframe diagram illustrating an embodiment comprising a USB Micro B receptacle recessed within a fastener, according to the present disclosure.

Figure 14 presents a wireframe diagram illustrating a longitudinal cross-section of an embodiment comprising a USB Micro B receptacle recessed within a fastener.

Figure 15 presents a pattern fill wireframe diagram illustrating a longitudinal cross- section of an embodiment comprising a USB Micro B receptacle recessed within a fastener.

Figure 16 presents a wireframe diagram illustrating an exploded view of an embodiment comprising a USB Micro B receptacle recessed within a fastener.

Figure 17 presents a pattern fill wireframe diagram illustrating an exploded view of an embodiment comprising a USB Micro B receptacle recessed within a fastener.

Figure 18 presents a wireframe diagram illustrating an exploded view of an embodiment comprising a bus connector recessed within a fastener of a device housing and wristbands configured to be coupled to the fastener.

Figure 19 presents a wireframe diagram illustrating an embodiment comprising a bus connector recessed within a fastener and wristbands removably coupled to the fastener.

Figure 20 presents a flowchart illustrating a first method for manufacturing an assembly comprising an electrical connector and device housing, according to certain embodiments of the present disclosure.

Figure 21 presents a flowchart illustrating a second method for manufacturing an assembly comprising an electrical connector and device housing, according to certain embodiments of the present disclosure. Figure 22 presents a flowchart illustrating a third method for manufacturing an assembly comprising an electrical connector and device housing, according to certain embodiments of the present disclosure.

Figure 23 presents a flowchart illustrating a fourth method for manufacturing an assembly comprising an electrical connector and device housing, according to certain embodiments of the present disclosure.

DETAILED DESCRIPTION

Many electrical devices require an electrical connection external to the device, whether to transmit or receive data, or as a power source. Many types of electrical connectors require a breach in the housing of a device or are themselves permeable to liquids. For example, electrical connectors are commonly coupled to device housings by simple covering or insertion. These electrical connectors allow liquids to seep into a device, either through the connector or in gaps between the connector and device housing.

It would be advantageous for many electrical devices to be waterproof despite comprising external electrical connectors. As used herein, waterproof refers to the ability of a device housing to prevent water or other liquid from passing from the exterior of the device housing to the interior of the device housing under the conditions for which the device was designed. Waterproof does not require that the housing be impermeable to liquids under any circumstances. For example, extreme pressures, extreme temperatures, or liquids that corrode or otherwise degrade the device housing may be able to permeate an otherwise waterproof housing. Similarly, a device may be waterproof even if the electrical connector does not function while exposed to liquids or does not function due to liquid-caused corrosion of the connector.

Overmolding is a method that may be used to form a device housing and the overmolding process may form a waterproof seal between a device housing and an electrical connector to which it is overmolded. Device housings may sometimes be referred to as cases, coverings, containers, or shells. As used herein, references to a housing may refer to part of a housing that does not form a complete housing. In some embodiments, the complete housing comprises two or more parts that, when fitted together, form a waterproof chamber. The housing has an inner surface exposed to the inner chamber and an outer surface facing towards the exterior of the device. If a housing refers to part of a complete housing, the inner and outer surfaces of the partial housing refer to the surfaces that would face towards the inner chamber and exterior, respectively, when functioning as part of a complete housing.

In some embodiments, the electrical connector functions as an injection molding insert and a housing may be overmolded onto the connector-insert. In these embodiments, the overmolding process both creates the housing and couples it to the electrical connector. Some embodiments use overmolded material as an intermediary to couple an electrical connector to a housing piece. In the latter embodiments, both the electrical connector and the housing piece serve as inserts for the overmolding process. If the electrical connector itself is permeable to water, overmolding may be used to seal gaps in the connector through which water could otherwise seep.

Electrical connectors may comprise one or more pins or other conductive surfaces. In some embodiments, a pin may be positioned crossways to the edge of a housing piece. Pins may be coupled to the housing piece by overmolding such that a portion of each pin is exposed on both the inner surface and the outer surface of the housing. In some

embodiments, a continuous perimeter around a central portion of each pin is in contact with the overmolded material . In some embodiments, the overmolded material is the housing itself. In some embodiments, an existing device housing contacts one side of the pin and additional overmolded material contacts a second side of the pin such that, together, the housing and overmolded material contact a continuous perimeter around a central portion of the pin.

Figures 1A - 1C presents three cross-sectional diagrams illustrating the position of a pin (10) relative to an insert (20) and overmolded material (30), according to certain embodiments of the present disclosure. Figures 1A - 1C each depict a transverse cross- section of a midsection of the pin (10), In each figure, a continuous perimeter around the pin (10) is in contact with the insert (20) and/or the overmolded material (30). Figure 1 A depicts the pin (10) positioned between the insert (20) and the overmolded material (30). Figure IB depicts the perimeter of the pin (10) surrounded entirely by the overmolded material (30) which is, optionally, coupled to an insert (20). Figure 1 C depicts the perimeter of the pin (10) surrounded entirely by the insert (20) which is coupled to the overmolded material (30).

Figures 2A - 2C present three cross-sectional diagrams illustrating the position of a pin ( 0) relative to an insert (20) and overmolded materials (30), according to certain embodiments of the present disclosure. Figures 2A - 2C each show a longitudinal cross- section of the pin (10). Figures 2A, 2B, and 2C correspond to Figures 1 A, IB, and 1C, respectively. In each figure, the pin (10) is exposed on both an inner surface and an outer surface of a device housing which comprises the insert (20) and the overmolded material (30). Figure 2 A depicts the pin (10) positioned between the insert (20) and the overmolded material (30). Figure 2B depicts the perimeter of the pin (10) surrounded entirely by the overmolded material (30) which is, optionally, coupled to the insert (20). Figure 2C depicts the perimeter of the pin (10) surrounded entirely by the insert (20) which is coupled to the overmolded material (30).

Figure 3 presents a wireframe diagram illustrating an embodiment (100) comprising a USB Standard A plug (110), according to the present disclosure. The USB plug (1 10) comprises a frame (111) an insulating tongue (112), a plurality of pins ( 1 13) and, optionally, an insulating cover (114). The insulating cover (1 14) may be initially coupled the USB plug (110) or be separately overmolded to the USB plug ( 1 10) during the manufacturing process. Thus, the insulating cover (114) may be viewed as part of the USB plug (110), a device housing (120), or as a separate component. In some embodiments the housing (120) is overmolded onto the USB plug (110, including the insulating cover, 114) and in some embodiments the insulating cover (114) is overmolded between the USB plug ( 1 10) and the housing (120) thereby coupling the plug (110) to the housing (120), Some embodiments lack an insulating cover altogether and have a housing overmolded directly onto the bus frame. (See Figure 11.) In this embodiment (100), the housing (120) contacts a continuous perimeter around the insulating cover (1 14). The housing (120) may be configured with an upper rim operable to couple with an upper panel (not shown) forming a waterproof seal between the upper rim and the upper panel, thus forming a waterproof chamber to house a device. In this embodiment (100), a fit-on structure (131 ) is coupled to terminal extensions (132) that serve as an electrical connection to the interior portion of the USB pins (1 13) and a printed circuit board (not shown). Other embodiments may use, for example, spring-loaded metal balls, locator holes, posts, or angled rods to connect the USB pins ( 1 13) to a printed circuit board (not shown).

Figure 4 presents a pattern fill wireframe diagram illustrating the embodiment (100) of Figure 3 comprising a USB Standard A plug (1 10), according to the present disclosure. The USB plug (110) comprises a frame (1 11, no pattern) an insulating tongue (1 12, vertical stripes), a plurality of pins (1 13 , dots) and, optionally, an insulating cover ( 1 14, cross hatch). The insulating cover (1 14) may be initially coupled the USB plug (110) or be separately overmolded to the USB plug ( 1 10) during the manufacturing process. Thus, the insulating cover (1 14) may be viewed as part of the USB plug (110), a device housing (120, micro dots), or as a separate component. Some embodiments overmold the housing (120) onto the USB plug (110, including the insulating cover, 114) and some embodiments overmold the insulating cover (1 14) between the USB plug (1 0) and the housing (120) coupling the plug (110) to the housing (120). Some embodiments lack an insulating cover altogether and have a housing overmolded directly onto the bus frame. (See Figure 11.) In this embodiment (100), the housing (120) contacts a continuous perimeter around the insulating cover (1 14). The housing (120) may be configured with an upper rim operable to couple with an upper panel (not shown) forming a waterproof seal between the upper rim and the upper panel, thus forming a waterproof interior chamber to house a device. In this embodiment (100), a fit-on structure (131, horizontal stripes) coupled to terminal extensions (132, dots) that serve as an electrical connection between the interior portion of the USB pins (113) and a printed circuit board (not shown). Other embodiments may use, for example, spring-loaded metal balls, locator holes, posts, or angled rods to connect the USB pins (113) to a printed circuit board (not shown).

Figure 5 presents a wireframe diagram illustrating a longitudinal cross-section of the embodiment (100) of Figures 3 and 4, according to the present disclosure. A USB Standard A plug (1 0) comprises a frame (11 1) an insulating tongue (1 12), a plurality of pins (113) and, optionally, an insulating cover (114). As revealed by the cross-sectional perspective, the housing (120) contacts portions of the frame (11 1), insulating tongue (112), and pins (113) as well as contacting a continuous perimeter around the insulating cover (1 14), The insulating cover (1 14) contacts a continuous perimeter around the frame (111), the frame (111) contacts a continuous perimeter around the insulating tongue (1 12), and the insulating tongue ( 12) contacts a continuous perimeter around each of the pins (113). Any of the previously mentioned continuous perimeters may form a waterproof seal. The housing (120) may be configured with an upper rim operable to couple with an upper panel (not shown) forming a waterproof seal between the upper rim and the upper panel, thus forming a waterproof interior chamber to house the device. In this embodiment, a fit-on structure (131) is coupled to terminal extensions (132) that serve as an electrical connection between the interior portion of the USB pins (1 13) and a printed circuit board (not shown).

Figure 6 shows a pattern fill wireframe diagram illustrating a longitudinal cross- section of the embodiment (100) of Figures 3, 4, and 5 comprising a USB Standard A plug (1 10), according to the present disclosure. The USB plug (110) comprises a frame (1 1 , no pattern) an insulating tongue ( 1 12, vertical stripes), a plurality of pins (113, dots) and, optionally, an insulating cover (1 14, cross hatch). As revealed by the cross-sectional perspective, the housing (120, micro dots) contacts portions of the frame (111), insulating tongue (112), and pins (1 13) as well as contacting a continuous perimeter around the insulating cover (114). The insulating cover ( 1 14) contacts a continuous perimeter around the frame (1 1 1), the frame (1 1 1) contacts a continuous perimeter around the insulating tongue (1 12), and the insulating tongue (1 2) contacts a continuous perimeter around each of the pins (113). Any of the previously mentioned continuous perimeters may form a waterproof seal. The housing (120) may be configured with an upper rim operable to couple with an upper panel (not shown) forming a waterproof seal between the upper rim and the upper panel, thus forming a waterproof interi or chamber to house the device. In this embodiment, a fit-on structure (131, horizontal stripes) is coupled to terminal extensions (132, dots) that create an electri cal connection between the interior portion of the USB pins (1 13) and a printed circuit board (not shown). Figure 7 presents a wireframe diagram illustrating an embodiment (200) comprising a

USB Micro B receptacle (210), according to the present disclosure. The USB receptacle (210) comprises a frame (21 1), an insulating tongue (212) and, optionally, an insulating cover (214). The insulating cover (214) may be initially coupled the USB receptacle (210) or be subsequently overmolded to the USB receptacle (210) during the manufacturing process. Thus, the insulating cover (214) may be viewed as part of the USB receptacle (210), a device housing (220), or as a separate component. Some embodiments overmold the housing (220) onto the USB receptacle (210, including the insulating cover, 214) and some embodiments overmold the insulating cover (214) between the USB receptacle (210) and the housing (220) coupling the receptacle (210) to the housing (220). Some embodiments lack an insulating cover altogether and have a housing overmolded directly onto the bus frame. (See Figure 1 1.) In this embodiment (200), the housing (220) contacts a continuous perimeter around the insulating cover (214). The housing (220) may be configured with an upper rim operable to couple with an upper panel (not shown) forming a waterproof seal between the upper rim and the upper panel, thus forming a waterproof chamber to house a device.

Figure 8 presents a pattern fill wireframe diagram illustrating the embodiment (200) of Figure 7, according to the present disclosure. The USB Micro B receptacle (210) comprises a frame (211, no pattern) an insulating tongue (212, dots) and, optionally, an insulating cover (214, horizontal stripes). The insulating cover (214) may be initially coupled the USB receptacle (210) or be separately overmolded to the USB receptacle (210) during the manufacturing process. Thus, the insulating cover (214) may be viewed as part of the USB receptacle (210), a device housing (220, micro dots), or as a separate component. Some embodiments overmold the housing (220) onto the USB receptacle (210, including the insulating cover, 214) and some embodiments overmold the insulating cover (214) between the USB receptacle (210) and the housing (220) coupling the receptacle (210) to the housing (220). Some embodiments lack an insulating cover altogether and have a housing

overmolded directly onto the bus frame. (See Figure 1 .) In this embodiment (200), the housing (220) contacts a continuous perimeter around the insulating cover (214). The housing (220) may be configured with an upper rim operable to couple with an upper panel (not shown) forming a waterproof seal between the upper rim and the upper panel, thus forming a waterproof interior chamber to house a device. Figure 9 presents a wireframe diagram illustrating a longitudinal cross-section of the embodiment (200) of Figures 7 and 8, according to the present disclosure. A USB Micro B receptacle (210) comprises a frame (21 1) an insulating tongue (212), a plurality of pins (213) and, optionally, an insulating cover (214). The cross-sectional perspective reveals that the housing (220) contacts portions of the frame (211), insulating tongue (212), and pins (213) as well as contacting a continuous perimeter around the insulating cover (214). The insulating cover (214) contacts a continuous perimeter around the frame (21 1), the frame (21 1) contacts a continuous perimeter around the insulating tongue (212), and the insulating tongue (212) contacts a continuous perimeter around each of the pins (213), Any of the previously mentioned continuous perimeters may form a waterproof seal. The housing (220) may be configured with an upper rim (221) operable to couple with an upper panel (not shown) with a waterproof seal between the upper rim and the upper panel, thus forming a waterproof interior chamber to house the device. In this embodiment, a fit-on structure (231) is coupled to terminal extensions (232) that serve as an electrical connection between the interior portion of the USB pins (213) and a printed circuit board (not shown). Other embodiments may use, for example, spring-loaded metal balls, locator holes, posts, or angled rods to connect the USB pins (2 3) to a printed circuit board (not shown).

Figure 10 presents a pattern fill wireframe diagram illustrating a longitudinal cross- section of the embodiment (200) of Figures 7, 8, and 9 according to the present disclosure. The USB Micro B receptacle (210) comprises a frame (211, no pattern) an insulating tongue (212, cross hatch), a plurality of pins (213, dots) and, optionally, an insulating cover (214, horizontal stripes). As revealed by the cross-sectional perspective, the housing (220, micro dots) contacts portions of the frame (21 1), insulating tongue (212), and pins (213) as well as contacting a continuous perimeter around the insulating cover (214). The insulating cover (214) contacts a continuous perimeter around the frame (211), the frame (211) contacts a continuous perimeter around the insulating tongue (212), and the insulating tongue (212) contacts a continuous perimeter around each of the pins (213). Any of the previously mentioned continuous perimeters may form a waterproof seal. The housing (220) may be configured with an upper rim operable to couple with an upper panel (not shown) forming a waterproof seal between the upper rim and the upper panel, thus forming a waterproof interior chamber to house the device. In this embodiment, a fit-on structure (231 , micro dots) is coupled to terminal extensions (232, dots) that serve as an electrical connection between the interior portion of the USB pins (213) and a printed circuit board (not shown). Other embodiments may use, for example, spring-loaded metal balls, locator holes, posts, or angled rods to connect the USB pins (213) to a printed circuit board (not shown).

Figure 11 presents a wireframe diagram illustrating a longitudinal cross-section of an embodiment (300) comprising a USB Micro B receptacle (310) to which a device housing (320) is overmolded, according to the present disclosure. The USB receptacle (310) comprises a frame (311) an insulating tongue (322) and a plurality of pins/terminals (313) that are exposed on both an inside surface and an outside surface of the device housing (320), The device housing (320) may be configured with an upper rim operable to couple with an upper panel (not shown) forming a waterproof seal between the upper rim and the upper panel, thus forming an interior chamber to house the device such that liquids cannot flow from the exterior of the device into the interior chamber. In this embodiment, the structure (321) supporting the terminal extensions (332) is part of the overmolded housing (320), Likewise, the insulating tongue (322) and insulating cover (324) are part of the overmolded housing (320), The terminal extensions (332) provide an electrical connection between the interior portion of the USB pins (313) and a printed circuit board (not shown). Other embodiments may use, for example, spring-loaded metal balls, locator holes, posts, or angled rods to connect the USB pins (313) to a printed circuit board (not shown).

Figure 2 presents a wireframe diagram illustrating an embodiment (400) comprising a USB Micro B receptacle recessed within a fastener (421). The fastener (421) is part of the device housing (420), which may be overmolded to the USB receptacle. The USB receptacle comprises a frame (41 1), an insulating tongue (412) and pins (413). The fastener (421) comprises an upper ridge (425), a lower ridge (426), and an end cap (428). In one

embodiment, the fasteners (421) at either end of the housing (420) may be slid into grooves of a mounting device (not shown) attached to, for example, a means for coupling the housing (420) to a user. The end cap (428) may serve to position the fastener (421) laterally in the mounting device or to limit the orientation of the device housing (420) relative to the mounting device. In this embodiment (400), the housing (420) contacts a continuous perimeter around the frame (41 1). The housing (420) may be configured with an upper rim operable to couple with an upper panel (not shown) forming a waterproof seal between the upper rim and the upper panel, thus forming a waterproof chamber.

Figure 13 presents a pattern fill wireframe diagram illustrating an embodiment (400) comprising a U SB Micro B receptacle recessed within a fastener. The fastener (421, micro dots) is part of the device housing (420, micro dots), which may be overmolded to the USB receptacle. The USB receptacle comprises a frame (41 , no pattern), an insulating tongue (412, vertical stripes) and pins (413, dots). The fastener (421) comprises an upper ridge

(425, micro dots), a lower ridge (426, micro dots), and an end cap (428, micro dots). In one embodiment, the fasteners (421) at either end of the housing (420) may be slid into grooves of a mounting device (not shown) attached to, for example, a means for coupling the housing

(420) to a user. The end cap (428) may serve to position the fastener (421) laterally in the mounting device or to limit the orientation of the device housing (420) relative to the mounting device. In this embodiment (400), the housing (420) contacts a continuous perimeter around the frame (411). The housing (420) may be configured with an upper rim operable to couple with an upper panel (not shown) forming a waterproof seal between the upper rim and the upper panel, thus forming a waterproof chamber.

Figure 14 presents a wireframe diagram illustrating a longitudinal cross-section of an embodiment (400) comprising a USB Micro B receptacle recessed within a fastener (421 ), The fastener (421) is part of the device housing (420), which may be overmolded to the USB receptacle. The receptacle comprises a frame (41 1) an insulating tongue (412), and a plurality of pins (413). The fastener (421) comprises an upper ridge (425), a lower ridge (426), and an end cap (428). In one embodiment, the fasteners (421) at either end of the housing (420) may be slid into grooves of a mounting device (not shown ) attached to, for example, a means for coupling the housing (420) to a user. The ridges (425, 426) on the upper and lower sides (respectively) of each fastener may prevent the housing from pulling away from the mounting in a direction perpendicular to the ridges while allowing the device housing (420) to be coupled or uncoupled with the mounting by sliding the fasteners (421) into or out of slots in the mounting. The end cap (428) may serve to position the fastener

(421) laterally in the mounting device or to limit the orientation of the device housing (420) relative to the mounting device. The cross-sectional perspective reveals that the housing (420) contacts a continuous perimeters around the frame (41 1) and insulating tongue (412), Either continuous perimeter may form a waterproof seal. In this embodiment, locator holes in the back of the insulating tongue (412) allow contact and electrical connection with the pins (413). Other embodiments may use, for example, spring-loaded metal balls, posts, or angled rods to connect the USB pins (413) to other components (not shown). The housing (420) may be configured with an upper rim operable to couple with an upper panel (not shown) with a waterproof seal between the rim and the upper panel, forming a waterproof interior chamber. Figure 15 presents a pattern fill wireframe diagram illustrating a longitudinal cross- section of an embodiment (400) comprising a USB Micro B receptacle recessed within a fastener (421). The fastener (421 , micro dots) is part of the device housing (420, micro dots), which may be overmolded to the USB receptacle. The receptacle comprises a frame (411, no pattern) an insulating tongue (412, vertical stripes), and a plurality of pins (413, dots). The fastener (421) comprises an upper ridge (425), a lower ridge (426), and an end cap (428). In one embodiment, the fasteners (421) at either end of the housing (420) may be sli d into grooves of a mounting device (not shown) attached to, for example, a means for coupling the housing (420) to a user. The ridges (425, 426) on the upper and lower sides (respectively) of each fastener prevent the housing from pulling away from the mounting in a direction perpendicular to the ridges while allowing the device housing (420) to be coupled or uncoupled with the mounting by sliding the fasteners (421 ) into or out of slots in the mounting. The end cap (428) may serve to position the fastener (421) laterally in the mounting device or to limit the orientation of the device housing (420) relative to the mounting device. The cross-sectional perspective reveals that the housing (420) contacts a continuous perimeters around the frame (41 1) and insulating tongue (412). Either continuous perimeter may form a waterproof seal. In this embodiment, locator holes in the back of the insulating tongue (412) allow contact and electrical connection with the pins (413) and a printed circuit board (not shown). Other embodiments may use, for example, spring-loaded metal balls, posts, or angled rods to connect the USB pins (413) to a printed circuit board (not shown). The housing (420) may be configured with an upper rim operable to couple with an upper panel (not shown) with a waterproof seal between the rim and the upper panel, forming a waterproof interior chamber.

Figure 16 presents a wireframe diagram illustrating an exploded view of an embodiment (400) comprising a USB Micro B receptacle recessed within a fastener. It is important to note that, given that the device housing (420) may be overmolded to the insulating tongue (412), it would be unlikely to see the component parts separated as they are in this diagram. The exploded view with separated parts is for illustrative purposes only. The fastener is part of the device housing (420), which may be overmolded to the USB receptacle. The receptacle comprises a frame (41 1) an insulating tongue (412), and a plurality of pins (413). The ridges (425, 426) on the upper and lower sides (respectively) of each fastener prevent the housing from pulling away from the mounting in a direction perpendicular to the ridges while allowing the device housing (420) to be coupled or uncoupled with the mounting by sliding the fasteners into or out of slots in the mounting. The end cap (428) may serve to position the fastener laterally in the mounting device or to limit the orientation of the device housing (420) relative to the mounting device. The exploded perspective reveals locator holes in the back of the insulating tongue (412) allowing contact and electrical connection between the pins (413) and a printed circuit board (not shown). The housing (420) may be configured with an upper rim operable to couple with an upper panel (not shown) with a waterproof seal between the rim and the upper panel, forming a waterproof interior chamber.

Figure 17 presents a pattern fill wireframe diagram illustrating an exploded view of an embodiment (400) comprising a USB Micro B receptacle recessed within a fastener. It is important to note that, given that the device housing (420, micro dots) may be overmolded to the insulating tongue (412, dots), it would be unlikely to see the component parts separated as they are in this diagram. The exploded view with separated parts is for illustrative purposes only. The fastener is part of the device housing (420, micro dots), which may be overmolded to the USB receptacle. The receptacle comprises a frame (41 1 , horizontal stripes) an insulating tongue (412, dots), and a plurality of pins (413). The ridges (425, 426) on the upper and lower sides (respectively) of each fastener prevent the housing from pulling away from the mounting in a direction perpendicular to the ridges while allowing the device housing (420) to be coupled or uncoupled with the mounting by sliding the fasteners into or out of slots in the mounting. The end cap (428) may serve to position the fastener laterally in the mounting device or to limit the orientation of the device housing (420) relative to the mounting device. The exploded perspective reveals locator holes in the back of the insulating tongue (412) allowing contact and electrical connection between the pins (413) and, for example, a printed circuit board (not shown). The housing (420) may be configured with an upper rim operable to couple with an upper panel (not shown) with a waterproof seal between the rim and the upper panel, forming a waterproof interi or chamber.

Figure 18 presents a wireframe diagram illustrating an embodiment (500) comprising a bus connector recessed within a fastener and wristbands removably coupled to the fastener, according to the present disclosure. A device housing (420), including two fasteners (421), are substantially similar to those presented in Figures 12-17. Each of two flexible bands (530) may removably coupled to the respective fasteners (421) by sliding a mounting portion of the band (535) over the fastener, thereby covering the bus connector (not visible). The bands (530) may be slid off of the fasteners, thus being removable and allowing the device housing to be coupled to a different mounting that, in turn, may be coupled to a different means of securing the device housing (420) to a user. For example, a mounting may be coupled to a belt clip, lanyard, safety pin, adhesive patch, or other means of securing the device housing to a user. Clear cover (540) may be coupled to the upper rim of device housing (420) forming a waterproof seal between the cover (540) and the device housing (420), in turn forming a waterproof chamber in device housing (420). Other components (550) of a device may be positioned in the waterproof chamber. Other components (550) may include, for example, a display screen visible through clear cover (540), a printed circuit board, vibrating motor, and/or wires for connecting the printed circuit board to the pins of the bus connector, Figure 19 presents a wireframe diagram illustrating an embodiment (500) comprising a bus connector recessed within a fastener and wristbands removably coupled to the fastener, according to the present disclosure. A device housing (420), including two fastener end caps (428), are substantially similar to those presented in Figures 12-18. Each of two flexible bands (530) are removably coupled to the respective fasteners by sliding a mounting portion of the band over the fasteners, thereby covering the bus connector (not visible). A clear cover (540) is coupled to the device housing (420) forming a waterproof seal between the cover (540) and the housing (420), thereby creating a waterproof chamber in the interior of the housing (420). The bands (530) and clear cover (540) are substantially similar to those presented in Figure 18 and present elements of Figure 18 in their assembled configuration, The bands (530) may be slid off of the fasteners, thus being removable and allowing the device housing to be coupled to a different mounting that, in turn, may be coupled to a different means of securing the device housing (420) to a user. For example, a mounting may be coupled to a belt clip, lanyard, safety pin, adhesive patch, or other means of securing the device housing to a user. End caps (428) prevent the bands (530) from sliding too far along the fasteners thereby securing the bands (530) in the proper orientation relative to the device housing (420). Embodiments include methods of manufacturing device housings comprising waterproof electrical connectors. Electrical connectors may include bus connectors such as those described herein. As described herein, bus connectors may include elements such as pins, frames, and insulating tongues. In embodiments that include insulating tongues, the insulating tongue may be overmolded to the pins which may be used as inserts.

Alternatively, the pins may be heated to a temperature sufficient to melt the material of the insulating tongue and then pressed through the tongue ("hot pressed"). In embodiments that comprise a frame, the frame may be wrapped around other parts of the bus. For example, a frame may be wrapped around the insulating tongue. In a second embodiment, the insulating tongue may be inserted into a frame that has previously been folded into the specified shape. In a third embodiment, the insulating tongue may be simultaneously overmolded to the frame and pins.

In some embodiments, a device housing is overmolded to a bus connector. The device housing may be overmolded to an insulating tongue forming a waterproof seal between the device housing and insulating tongue. In some embodiments, the device housing is overmolded to a frame forming a waterproof seal between the device housing and frame. In some embodiments, the device housing is overmolded to both an insulating tongue and a frame and forms a waterproof seal between the device housing and the bus, comprising a combination of waterproof contacts between housing and tongue and between housing and frame.

In some embodiments, the pins are the only element of the bus connector that traverse the device housing from the outer surface of the device housing to the inner surface of the device housing. In these embodiments, a waterproof seal between the device housing and the pins is sufficient to maintain the waterproof integrity of the housing; a waterproof seal between the housing and tongue is not necessary nor is a waterproof seal between the housing and frame necessary.

In some embodiments, an insulating cover may be overmolded to one or more parts of the bus connector. For example, an insulating cover may be overmolded to a frame, an insulating tongue, or a combination of frame and tongue. The device housing, in turn, may be overmolded to an assembly comprising a tongue, frame, and insulating cover, and the overmolded device housing may contact one or more of the bus elements. In some embodiments, a bus (or parts of a bus) are overmolded to a frame.

Figure 20 presents a flowchart illustrating a method (2000) for manufacturing an assembly comprising an electrical connector and device housing, according to certain embodiments of the present disclosure. An insulating tongue is overmolded to a plurality of pins (2010). A metal frame is then folded around the assembly comprising the tongue and pins (2020). A device housing is then overmolded to the tongue and frame such than the pins extend on both the inner and outer surfaces of the housing (2040), Assembly of the device may then be completed (2050). Completion may include, without limitation, connection of electronic circuitry to the pins, securing electronic circuitry or displays within the housing, or coupling a cover to the device housing to form a waterproof chamber in the housing.

Figure 21 presents a flowchart illustrating a method (2100) for manufacturing an assembly comprising an electrical connector and device housing, according to certain embodiments of the present disclosure. A plurality of pins are hot-pressed through an insulating tongue (21 10). The assembly comprising the tongue and pins is then inserted into a pre-folded frame (2120). An insulating cover is then overmolded to the assembly comprising the tongue and frame (2130). A device housing is then overmolded to the tongue and insulating cover such than the pins extend on both the inner and outer surfaces of the housing ( 540). Assembly of the device may then be completed (2050). Completion may include, without limitation, connection of electronic circuitry to the pins, securing electronic circuitry or displays within the housing, or coupling a cover to the device housing to form a waterproof chamber in the housing.

Figure 22 presents a flowchart illustrating a method (2200) for manufacturing an assembly comprising an electrical connector and device housing, according to certain embodiments of the present disclosure. An insulating tongue is overmolded to a plurality of pins and a frame, both the pins and the frame serving as inserts in a single machine cycle (2210). The frame, tongue, and pins are elements of a connector assembly. An insulating cover is then overmolded to the connector assembly and a device housing, both the connector assembly and device housing serving as inserts in the same machine cycle (2230). Assembly of the device may then be completed (2050). Completion may include, without limitation, connection of electronic circuitry to the pins, securing electronic circuitry or displays within the housing, or coupling a cover to the device housing to form a waterproof chamber in the housing.

Figure 23 presents a flowchart illustrating a method (2300) for manufacturing an assembly comprising an electrical connector and device housing, according to certain embodiments of the present disclosure. In this embodiment, the device housing is overmolded directly to the pins of the electrical connector (2310). The device housing around the pins may be shaped to conform to the standards of a particular type of electrical connector. Assembly of the device may then be completed (2050). Completion may include, without limitation, connection of electronic circuitry to the pins, securing electronic circuitry or displays within the housing, or coupling a cover to the device housing to form a waterproof chamber in the housing.

While some examples depicted herein comprise bus connectors that conform to USB standards, those in the art will recognize that the principles described herein could be applied to bus connectors conforming to any of a number of standards including, without limitation, Firewire (IEEE 1394), and Ethernet (IEEE 802.3af). The process of overmolding a housing or portion of a housing may be applied to electrical connectors, generally.

The above description is neither exclusive nor exhaustive and is intended neither to describe ail possible embodiments (also called "examples") nor to limit the scope of the claims. Embodiments may include elements in addition to those in the described

embodiments and, in some cases, may contain only a subset of the elements described in a particular embodiment. Embodiments may contain any combination of elements in the described embodiments in addition to elements not expressly described. As used herein, the articles "a" and "an" may include one or more than one of the noun modified by either without respect to other uses of phrases such as "one or more" or "at least one," The word "or" is used inclusively unless specified otherwise. Terms such as "first," "second," "third" and so forth are used as labels to distinguish elements and do not indicate sequential order unless specified otherwise. In addition to the embodiments described above, embodiments include any that would fall within the scope of the claims, below.