Title:
METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUCTURE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/170738
Kind Code:
A1
Abstract:
This method for manufacturing a wire bonding structure is provided with: a step for preparing a wire formed of Cu; and a step for bonding the wire to a first subject to be bonded to, said first subject being formed on an electronic element. Prior to the bonding step, the wire has an outer circumferential surface and a retracted surface. The retracted surface is a surface retracted to the center axis side of the wire from the outer circumferential surface. In the bonding step, ultrasonic vibration is applied to the wire in a state wherein the retracted surface is pressed to the first subject.
Inventors:
IKOMA KAZUYA (JP)
Application Number:
PCT/JP2015/063293
Publication Date:
November 12, 2015
Filing Date:
May 08, 2015
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L21/60; H01L21/607
Foreign References:
| JPH10199913A | 1998-07-31 | |||
| JP2000357705A | 2000-12-26 | |||
| JP2013004779A | 2013-01-07 |
Attorney, Agent or Firm:
YOSHIDA Minoru et al. (JP)
Yoshida 稔 (JP)
Yoshida 稔 (JP)
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