Title:
METHOD OF MANUFACTURING WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2001/062055
Kind Code:
A1
Abstract:
The invention provides a method of manufacturing a wiring board, in which conductor patterns are formed with high positional and dimensional accuracy. Aluminum foil (4) is fixed to a stainless steel support board (1), and a conductor layer (6) (copper patterns 6A and 6B) is formed on the aluminum foil (4). Such structures are stacked and hot-pressed with insulating layers (10) in between. Via holes are provided in the insulating layers (10).
Inventors:
WATANABE HIROYUKI (JP)
Application Number:
PCT/JP2001/000776
Publication Date:
August 23, 2001
Filing Date:
February 02, 2001
Export Citation:
Assignee:
IBIDEN CO LTD (JP)
ADACHI SHINJI (JP)
WATANABE HIROYUKI (JP)
ADACHI SHINJI (JP)
WATANABE HIROYUKI (JP)
International Classes:
H05K3/46; H05K3/20; (IPC1-7): H05K3/46; B32B31/20; H05K3/20
Foreign References:
| JPH08204333A | 1996-08-09 | |||
| JPS56155587A | 1981-12-01 |
Attorney, Agent or Firm:
Okado, Akiyoshi (Nagoya Center Building Annex 2-2, Nishiki 2-chome Naka-ku Nagoya-shi Aichi, JP)
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