Title:
METHOD FOR MANUFACTURING WIRING PATTERN, METHOD FOR MANUFACTURING ELECTROCONDUCTIVE FILM, METHOD FOR MANUFACTURING TRANSISTOR
Document Type and Number:
WIPO Patent Application WO/2017/030050
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a technique for obtaining a wiring pattern by electroless plating without the use of a lift-off process. A method for manufacturing a wiring pattern, characterized in having a base layer formation step for forming a base layer that includes an electroless-plating catalyst and a resin, a surface layer removal step for removing at least a portion of the surface layer of the base layer, and a plating layer formation step for carrying out electroless plating and forming a plating layer on the base layer, which has undergone the surface layer removal step.
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Inventors:
KOIZUMI SHOHEI (JP)
KAWAKAMI YUSUKE (JP)
KAWAKAMI YUSUKE (JP)
Application Number:
PCT/JP2016/073459
Publication Date:
February 23, 2017
Filing Date:
August 09, 2016
Export Citation:
Assignee:
NIKON CORP (JP)
International Classes:
H05K3/18; C23C18/18
Foreign References:
| JP2004233835A | 2004-08-19 | |||
| JP2007087979A | 2007-04-05 | |||
| JP2001135168A | 2001-05-18 | |||
| JP2014214353A | 2014-11-17 | |||
| JP2006259383A | 2006-09-28 | |||
| JP2010062399A | 2010-03-18 | |||
| JP2015087611A | 2015-05-07 |
Attorney, Agent or Firm:
SHOYO INTELLECTUAL PROPERTY FIRM (JP)
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