Title:
METHOD FOR MANUFACTURING WOUND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2015/178165
Kind Code:
A1
Abstract:
The purpose of this invention is to provide a method that is used to manufacture a wound electronic component using twisted wires and makes it possible, when twisting a plurality of winding wires together, to minimize breakage thereof. This method for manufacturing a wound electronic component (1) includes a preparation step in which a chuck (C1) is used to grip a core (12) that has a winding-core section (14) and flanges (16 and 18), a first step in which part of each of a number of winding wires (20, 21) supplied from respective nozzles (N1, N2) is affixed to one of the flanges (16), and a second step in which the chuck (C1) is rotated so as to twist the winding wires (20, 21).
Inventors:
YAMAKITA TAKAYUKI (JP)
Application Number:
PCT/JP2015/062565
Publication Date:
November 26, 2015
Filing Date:
April 24, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F41/06; H01F41/04
Foreign References:
| JPH1050542A | 1998-02-20 | |||
| JP2010147132A | 2010-07-01 | |||
| JP2003109836A | 2003-04-11 | |||
| JP2004119922A | 2004-04-15 |
Attorney, Agent or Firm:
PROFIC PC (JP)
Patent business corporation pro フィック patent firm (JP)
Patent business corporation pro フィック patent firm (JP)
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