Title:
METHOD OF MANUFACTURING WOVEN MESH SUBSTRATE WITH SEMICONDUCTORS, DEVICE FOR MANUFACTURING SAME, AND WOVEN MESH SUBSTRATE WITH SEMICONDUCTORS
Document Type and Number:
WIPO Patent Application WO/2012/026013
Kind Code:
A1
Abstract:
A method of manufacturing a woven mesh substrate with semiconductors (1), which embeds a plurality of globular semiconductor elements (3), having either a light-receiving or a light-emitting function, in a mesh-shaped woven substrate (2) having a plurality of insulating wires (21) being vertical threads and a plurality of conducting wires (22) being horizontal threads, comprises the steps of: forming gaps by using a heddle mechanism (53) to make a first vertical thread group, including a plurality of vertical threads, and a second vertical thread group, including a plurality of vertical threads positioned parallel to, and alternating with, the first vertical thread group, move up and down; using a shuttle mechanism (54) to supply the horizontal threads into the gaps between the first and second vertical thread groups, and beating the horizontal threads with a reed mechanism (55); coating, with a first conductive binder (4), a plurality of regions of the beaten horizontal threads, with a plurality globular semiconductor elements connected to said regions; embedding the plurality of globular semiconductor elements at the regions coated with the first conductive binder, and connecting a plurality of first electrodes (31) respectively at the plurality of potentials; and coating, with a second conductive binder (5), a plurality of second electrodes (32) of the plurality of globular semiconductor elements.
Inventors:
NAKATA JOSUKE (JP)
Application Number:
PCT/JP2010/064459
Publication Date:
March 01, 2012
Filing Date:
August 26, 2010
Export Citation:
Assignee:
KYOSEMI CORP (JP)
NAKATA JOSUKE (JP)
NAKATA JOSUKE (JP)
International Classes:
H01L31/042; D03D1/00; D03D41/00; H01L33/00
Domestic Patent References:
| WO2005041312A1 | 2005-05-06 | |||
| WO2004001858A1 | 2003-12-31 |
Foreign References:
| JPS6068507A | 1985-04-19 |
Attorney, Agent or Firm:
OKAMURA, TOSHIO (JP)
Toshio Okamura (JP)
Toshio Okamura (JP)
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Claims: