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Title:
METHOD FOR MEASURING CHANGE IN PHYSICAL QUANTITY OF ADHERED SUBSTANCE BY MEANS OF QCM SENSOR
Document Type and Number:
WIPO Patent Application WO/2023/048296
Kind Code:
A1
Abstract:
[Problem] To observe a change of state that occurs due to a change in a physical quantity such as a weight or modulus of elasticity of an adhered substance on an adherend, in a method for measuring the change in the physical quantity using a QCM sensor. [Solution] In this method for measuring a change in a physical quantity of an adhered substance, where said physical quantity changes as a result of an external stimulus, the change in the physical quantity of the adhered substance on the adherend is measured by causing a detecting portion, in which a sensor that includes a crystal oscillator is covered by the adherend with the adhered substance overlapping the adherend, to resonate in a medium, and measuring an amount of change in a resonant frequency of the crystal oscillator, said change occurring as a result of the external stimulus acting on the detecting portion. In the measuring method, the external stimulus is an administration of a drug or a change in temperature, and the change in the physical quantity is a change in the modulus of elasticity of the adhered substance, a change in the modulus of elasticity of a laminated portion, said change resulting from peeling of the adhered substance on the surface of the adherend, or a change in the weight of the adhered substance. In the measuring method, the medium is a gas or a liquid.

Inventors:
KITAGAWA HIROTAKE (JP)
MATSUBARA KOTATSU (JP)
OHORI TAKAHIRO (JP)
KASHIHARA MASAYA (JP)
Application Number:
PCT/JP2022/035992
Publication Date:
March 30, 2023
Filing Date:
September 27, 2022
Export Citation:
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Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
G01N5/02; G01N19/00; G01N19/04
Domestic Patent References:
WO2019239950A12019-12-19
Foreign References:
JP2012137483A2012-07-19
JP2002333394A2002-11-22
JP2010271285A2010-12-02
US20210190727A12021-06-24
Other References:
YOSHIHARA, SACHIO: "Newly Developed Anti-Ionic Migration Tests for Lead-Free Solders", EREKUTORONIKUSU JISSO GAKKAISHI - JOURNAL OF JAPAN INSTITUTE OFELECTRONICS PACKAGING, EREKUTORONIKUSU JISSO GAKKAI, TOKYO, JP, vol. 4, no. 4, 1 July 2001 (2001-07-01), JP , pages 267 - 271, XP009545154, ISSN: 1343-9677, DOI: 10.5104/jiep.4.267
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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