METHOD FOR MEASURING CROSS-LINK DENSITY OF OBJECT TO BE TESTED, METHOD FOR SETTING CONDITIONS OF CROSS-LINK DENSITY OF OBJECT TO BE TESTED, LAMINATION METHOD FOR LAMINATED PRODUCT, DEVICE FOR MEASURING CROSS-LINK DENSITY OF OBJECT TO BE TESTED, AND DEVICE FOR ADJUSTING CROSS-LINK DENSITY OF OBJECT TO BE TESTED

WIPO Patent Application WO/2011/111868

A1

The disclosed method and device for rapidly analysing cross-link density enable the easy and accurate measurement of cross-link density in the lamination process. An object (1A) to be tested is prepared by sandwiching a sheet for measuring cross-link density between a transparent substrate and a rear surface material. The object (1A) to be tested is placed in a lamination means (100) and lamination is implemented. The object (1A) to be tested is taken out from the lamination means (100), the transparent substrate and rear surface material are detached from the sheet for measuring cross-link density, and the sheet for measuring cross-link density is removed. A reference point and at least one comparison point on the sheet for measuring cross-link density are chosen and the cross-link density of the points is measured. The sheet for measuring cross-link density exhibits a cross-linking reaction by lamination and bonds with neither the transparent substrate nor the rear surface material by the cross-linking reaction.

NAKAHAMA HIDENARI (JP)
IIDA HIROTAKA (JP)
NAKANO HIROSHI (JP)

PCT/JP2011/056142

September 15, 2011

March 09, 2011

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NISSHINBO MECHATRONICS INC (JP)
NAKAHAMA HIDENARI (JP)
IIDA HIROTAKA (JP)
NAKANO HIROSHI (JP)

B29C65/82; G01N33/44; H01L31/042

JP2008117926A	2008-05-22
JP2007240359A	2007-09-20
JPH11216832A	1999-08-10
JPH04204364A	1992-07-24
JP2003344322A	2003-12-03

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