Title:
METHOD FOR MEASURING INTERFACIAL ADHESION OF FILM
Document Type and Number:
WIPO Patent Application WO/2013/162152
Kind Code:
A1
Abstract:
The present invention relates to a method for easily measuring the interfacial adhesion of a film by inducing a preliminary crack on a substrate and then using same to peel off the film from the substrate. The method according to one aspect of the present invention comprises: a step of placing an indenter on the surface opposite the surface of a test material that is the substrate on which a predetermined film is formed; a step of forming a crack on the substrate by applying a first indentation load to the test material using the indenter; a step of measuring the surface adhesion of the film by applying a second indentation load from the other surface of the portion of the test material where the crack is formed and peeling the substrate and the film apart from each other.
Inventors:
LEE YUN-HEE (KR)
KIM YONG IL (KR)
HAHN JUN HEE (KR)
KIM YONG IL (KR)
HAHN JUN HEE (KR)
Application Number:
PCT/KR2012/011365
Publication Date:
October 31, 2013
Filing Date:
December 24, 2012
Export Citation:
Assignee:
KOREA RES INST OF STANDARDS (KR)
International Classes:
G01N19/04; G01N3/02
Foreign References:
| KR20020086019A | 2002-11-18 | |||
| JP2011203178A | 2011-10-13 | |||
| CN101144770A | 2008-03-19 | |||
| JP2006284453A | 2006-10-19 | |||
| JP2009079985A | 2009-04-16 | |||
| JP2004138469A | 2004-05-13 |
Attorney, Agent or Firm:
LEE, In-Haeng et al. (KR)
이인행 (KR)
이인행 (KR)
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