METHOD FOR MEASURING THERMAL PROPERTY BY USING LOCK-IN THERMOGRAPHY

WIPO Patent Application WO/2017/222115

A1

The present invention relates to a method for measuring a thermal property by using lock-in thermography and, more specifically, to a method for measuring a thermal property by using lock-in thermography, capable of measuring a mean thermal property even though a plurality of unit bodies having different thermal properties are stacked to form a single module, the method comprising: an arrangement step of placing a sample module on a heat source substrate including a plurality of heat sources; a signal application step of applying a predetermined waveform of energy to the heat source substrate; a signal measurement step of measuring a signal appearing on the upper surface of the sample module according to thermal energy transferred through the sample module coming in contact with heat sources of the heat source substrate, and a signal appearing on heat sources of the heat source substrate on which the sample module is not arranged; and a thermal property estimation step of estimating a mean thermal property of the sample module by using the signals measured in the signal measurement step.

KIM SEONJIN (KR)
LEE KYE-SUNG (KR)
HUR HWAN (KR)
KIM GEON-HEE (KR)

PCT/KR2016/012445

December 28, 2017

November 01, 2016

Click for automatic bibliography generation  

KOREA BASIC SCIENCE INST (KR)

G01N25/18; G01J5/48; G01J5/60; G01N25/32

US20150153293A1	2015-06-04
US20050002436A1	2005-01-06
KR20020073978A	2002-09-28
KR101551609B1	2015-09-08
KR101528200B1	2015-06-12

PLUS INTERNATIONAL IP LAW FIRM (KR)

View/Download PDF      PDF Help

Previous Patent: VEHICULAR ANTENNA

Next Patent: STANDARD SAMPLE FOR CALIBRATION OF NANOSCALE ANALYSIS EQUIPMENT