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Title:
METHOD FOR MECHANICALLY SEPARATING DIFFERENT SEMICONDUCTOR, INSULATING OR METAL MATERIALS FROM A COMPONENT OR MODULE, FOR EXAMPLE A PHOTOVOLTAIC MODULE, IN ORDER TO RECYCLE SAME
Document Type and Number:
WIPO Patent Application WO/2024/068828
Kind Code:
A1
Abstract:
The invention relates to a method for mechanically separating different materials from an electronic module at end of life, the method comprising: a) providing a mixture of first (101) and second (103) elements, in the form of pieces, each piece having three dimensions in an orthonormal frame of reference, the first elements (101) having at least one dimension of the order of millimeters and the second elements (103) having dimensions smaller than 500 μm and at least one dimension smaller than 50 μm; b) arranging the first and second elements in a trough (1); c) spatially separating the first (101) and second (102) elements toward a downstream end (14a) and an upstream end (13a), respectively, by applying a mechanical vibration to the trough (1), which is inclined by an angle (α) of between 10° and 30°.

Inventors:
CHICHIGNOUD GUY (FR)
MOENNE JORIS (FR)
Application Number:
PCT/EP2023/076868
Publication Date:
April 04, 2024
Filing Date:
September 28, 2023
Export Citation:
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Assignee:
ROSI (FR)
International Classes:
B07B1/28; B07B13/00; B07B13/11; H01L31/18
Foreign References:
EP2786810B12022-04-27
EP3989296A12022-04-27
FR3096833A12020-12-04
DE2105342A11972-08-10
DE1276573B1968-09-05
EP0867234B12002-07-17
DE3501777A11985-08-08
FR3096833A12020-12-04
Attorney, Agent or Firm:
IP TRUST (FR)
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