Title:
METHOD FOR MELTING RECOVERED PRINTING PLATES AND METHOD FOR RECYCLING
Document Type and Number:
WIPO Patent Application WO/2011/111525
Kind Code:
A1
Abstract:
Disclosed is a method in which oxidation loss can be reduced by directly melting recovered printing plates with new ore so that a molten yield as high as the melting of regenerated metal can be obtained. Specifically disclosed is a melting method for melting recovered printing plates (35), comprising used planographic printing plates (36) and/or fragments (33) such as cut pieces of planographic printing plates, and new ore (37) by a burner (19) in a melting furnace (13). The melting method comprises a first input step of forming an accumulation of recovered printing plates (35) on the furnace floor (13B) of the melting furnace (13) by first inserting recovered printing plates (35) into the melting furnace (13) and a second input step of introducing new ore (37) on top of the accumulation of recovered printing plates so as to cover the plates with substantially no exposure, and melting is carried out by striking the new ore with flames from burners.
Inventors:
OSADA MASAKAZU (JP)
YAMAZAKI TORU (JP)
YAMAZAKI TORU (JP)
Application Number:
PCT/JP2011/053945
Publication Date:
September 15, 2011
Filing Date:
February 23, 2011
Export Citation:
Assignee:
FUJIFILM CORP (JP)
OSADA MASAKAZU (JP)
YAMAZAKI TORU (JP)
OSADA MASAKAZU (JP)
YAMAZAKI TORU (JP)
International Classes:
B41N1/08; C22B9/16; B41N3/00; C22B21/00; F27B3/10; F27B3/20; F27D7/06
Domestic Patent References:
| WO2009084568A1 | 2009-07-09 |
Foreign References:
| JP2002225449A | 2002-08-14 | |||
| JP2007063583A | 2007-03-15 | |||
| JP2007224391A | 2007-09-06 |
Other References:
See also references of EP 2546369A4
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
Kenzo Matsuura (JP)
Kenzo Matsuura (JP)
Download PDF:
Claims:
Previous Patent: SUBSTRATE WIRING METHOD AND SEMICONDUCTOR MANUFACTURING DEVICE
Next Patent: CURRENT DETECTION DEVICE
Next Patent: CURRENT DETECTION DEVICE