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Patent Searching and Data


Title:
REPAIR/MODIFICATION METHOD FOR METALLIC SUBSTRATES
Document Type and Number:
WIPO Patent Application WO/2019/151057
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a repair/modification method for metallic substrates that is capable of reducing both defects and regions of interface in the interior of a structural body by means of modifying the arrangement deep into the interior of a structural body while preventing impurities that, for example, originate with a probe on a friction stir welding tool from being mixed into the interior of the structural body. The repair/modification method for metallic substrates pertaining to the present invention involves: a step for preparing a metallic substrate having a first region that is divided in the in-plane direction of the substrate and contains a defect and/or a structurally discontinuous part; and a step for repairing the defect and/or modifying the structurally discontinuous part by causing a probeless friction tool to be rotatingly pressed against the surface of the first region, thereby generating frictional heat while pressing on the surface.

Inventors:
ANO GENKI (JP)
MARUKO TOMOHIRO (JP)
MIYAZAWA TOMOAKI (JP)
IWAMOTO YUICHI (JP)
Application Number:
PCT/JP2019/001953
Publication Date:
August 08, 2019
Filing Date:
January 23, 2019
Export Citation:
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Assignee:
FURUYA METAL CO LTD (JP)
International Classes:
C22F1/14; B23K20/12; C22F1/08
Domestic Patent References:
WO2013137030A12013-09-19
Foreign References:
JP2007530791A2007-11-01
JP2015217434A2015-12-07
JP2003053586A2003-02-26
JP2013107129A2013-06-06
JP2011074425A2011-04-14
JP2003089884A2003-03-28
Attorney, Agent or Firm:
IMASHITA, Katsuhiro et al. (JP)
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