Title:
METHOD FOR MOLDING FOAMABLE RESIN AND MOLD FOR MOLDING FOAMABLE RESIN
Document Type and Number:
WIPO Patent Application WO/2011/158414
Kind Code:
A1
Abstract:
Only the periphery of a portion to be prevented from decreasing in strength is solidified by local cooling before bubbles grow, thereby forming a wall for flow prevention. Thereafter, a pin (107) or the like is plunged into the molten resin present inside the periphery to reduce the volume of the cavity (3). As a result, the bubbles become small or the foaming gas is partly absorbed into the resin. Thus, the volume of the expanded bubbles is reduced to thereby inhibit the strength from decreasing.
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Inventors:
FUJIOKA, Toshiyuki (())
Application Number:
JP2011/002111
Publication Date:
December 22, 2011
Filing Date:
April 11, 2011
Export Citation:
Assignee:
PANASONIC CORPORATION (1006, Oaza Kadoma Kadoma-sh, Osaka 01, 〒5718501, JP)
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
International Classes:
B29C45/56; B29C45/26; B29C45/73; B29K105/04
Attorney, Agent or Firm:
MORIMOTO INT'L PATENT OFFICE (ORIX Hommachi Bldg, 4th Floor,4-1, Nishi-Honmachi 1-chome, Nishi-ku, Osaka-sh, Osaka 05, 〒5500005, JP)
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