Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR MOLDING FOAMED RESIN, FOAMED RESIN MOLDED BODY, FOAMED RESIN BOX BODY, REFRIGERATOR, AND DEVICE FOR MOLDING FOAMED RESIN
Document Type and Number:
WIPO Patent Application WO/2014/002869
Kind Code:
A1
Abstract:
In the present invention, a foamed resin is molded while suppressing the occurrence of bubble entrainment in which bubbles remain in a hard layer. The method for molding a foamed resin by molding the surface of the foamed resin using a die includes: a step for heating the die; a step for pressing the die against the foamed resin, thus defoaming the surface of the foamed resin while applying pressure; a step for cooling the foamed resin while applying pressure; and a step for removing the die from the foamed resin.

More Like This:
WO/2001/034372PROCESS OF MAKING ANISOTROPIC SEMIPERMEABLE MEMBRANE
JP2000062031MOLDING METHOD OF FOAMED SYNTHETIC RESIN MOLDED BODY AND FOAMED SYNTHETIC RESIN MOLDED BODY
JP2000046287HEAT INSULATING MATERIAL
Inventors:
INUI HITOSHI
NAKANISHI YASUNORI
NAGATA TAKESHI
Application Number:
PCT/JP2013/066966
Publication Date:
January 03, 2014
Filing Date:
June 20, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHARP KK (JP)
International Classes:
B29C67/20
Foreign References:
JPS5249022B11977-12-14
JPS562138A1981-01-10
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: SOLAR CELL MODULE

Next Patent: ULTRASONIC DIAGNOSTIC DEVICE AND SENSOR SELECTION DEVICE