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Title:
METHOD FOR MONITORING EJECTION FORCE OF EJECTOR PIN DURING CHIP FILM-PLATING PROCESS
Document Type and Number:
WIPO Patent Application WO/2021/164115
Kind Code:
A1
Abstract:
Provided is a method for monitoring the ejection force of an ejector pin (110) during a chip film-plating process. The method comprises the following steps: performing code scanning on an electroplating jig (600) on which chips are placed, and recording the serial number of the scanned code; arranging ejector pins (110) in rows, wherein each ejector pin (110) is connected to an S-type force sensor (120), each S-type force sensor (120) is connected to an industrial personal computer, and the industrial personal computer numbers each S-type force sensor (120) to monitor the ejection force borne by each chip, and during the process of the ejector pins (110) ejecting the chips, recording the ejection force of each ejector pin (110) to form a force curve; and comparing the peak value of the force curve with a pre-set threshold value, and by means of the serial number of the scanned code, the number of times that a Z-axis movement mechanism (130) driving the ejector pins (110) operates, the serial number of the S-type force sensor (120) and the industrial personal computer, recording a chip for which the threshold value is exceeded and the position thereof, and marking same as an NG product.

Inventors:
JIANG HAIBING (CN)
Application Number:
PCT/CN2020/085105
Publication Date:
August 26, 2021
Filing Date:
April 16, 2020
Export Citation:
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Assignee:
HIMIT SHENZHEN TECH CO LTD (CN)
International Classes:
G01L5/00
Foreign References:
CN102510677A2012-06-20
CN110416859A2019-11-05
CN207248404U2018-04-17
CN103364114A2013-10-23
CN101877324A2010-11-03
US5644247A1997-07-01
Other References:
GUO QIANGSHENG: "A Study On The Movement Control Technology of Die Picking Mechanism of LED die Bonder", EQUIPMENT FOR ELECTRONIC PRODUCTS MANUFACTURING, 30 June 2015 (2015-06-30), pages 27 - 32, XP055838573, ISSN: 1004-4507
Attorney, Agent or Firm:
SHENZHEN DAOQINZHIKU INTELLECTUAL PROPERTY AGENCY (LLP) (CN)
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