Title:
METHOD OF MOUNTING LIGHT-EMITTING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2017/047011
Kind Code:
A1
Abstract:
The present invention provides a method of mounting a light-emitting element, including: employing epitaxial growth to grow and form a first semiconductor layer, an active layer, a second semiconductor layer and a buffer layer successively on a starting substrate using a material that is lattice-matched to the starting substrate; employing epitaxial growth to form, on the buffer layer, a window layer/support substrate using a material that is not lattice-matched to the starting substrate; removing the starting substrate; forming a first ohmic electrode on the first semiconductor layer; forming a partial removed portion exposing the second semiconductor layer, the buffer layer or the window layer/support substrate, to provide a step; forming a second ohmic electrode in the removed portion; fabricating a light-emitting element chip by separating a light-emitting element in which the first and second ohmic electrodes are formed; and flip-mounting the light-emitting element chip onto a mounting substrate in such a way that the side of the light-emitting element chip on which the first and second ohmic electrodes are formed is closest to the mounting substrate. The present invention thus provides a method of mounting a light emitting element with which it is possible for a light-emitting element chip to be mounted easily even if there is a large step between the first and second ohmic electrodes.
Inventors:
ISHIZAKI JUNYA (JP)
FURUYA SHOGO (JP)
FURUYA SHOGO (JP)
Application Number:
PCT/JP2016/003914
Publication Date:
March 23, 2017
Filing Date:
August 29, 2016
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
H01L33/30; H01L33/62
Foreign References:
| JP2006352089A | 2006-12-28 | |||
| US6274399B1 | 2001-08-14 | |||
| JP2011091443A | 2011-05-06 | |||
| JP2007335462A | 2007-12-27 |
Attorney, Agent or Firm:
YOSHIMIYA, Mikio et al. (JP)
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