METHOD OF ONLINE PREDICTING APPARATUS MAINTENANCE

WIPO Patent Application WO/2008/034343

A1

A method of online predicting apparatus maintenance is disclosed. Using optical emission spectroscopy (OES) positioned on the apparatus and the change of emission spectra intensities detected by the OES in the processes, according to the detected results, measuring the parameters in the processes, the function relation between the processing parameters and spectra intensities is acquired. A control threshold is decided by the processing requirement of apparatus. When the parameter exceeds the control threhold, etch apparatus maintenance is engaged in order to avoid processing error caused by frequent stop or deficient maintenance which is estimated by the experience, and decrease the cost and increase processing substrates (such as silicon wafer ) efficiency of without changing apparatus and adding other online sensors, and improve regular rate by avoiding waste wafer caused by error processes. The method is suitable for semiconductor wafer etch apparatus maintenance and other apparatus maintenance.

CHEN ZHUO (CN)
HU LIQIONG (CN)
XIE KAI (CN)

PCT/CN2007/002654

March 27, 2008

September 05, 2007

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BEIJING NMC CO LTD (CN)
CHEN ZHUO (CN)
HU LIQIONG (CN)
XIE KAI (CN)

H01L21/66; G06F11/30; H01L21/3065

WO2005111265A1

2005-11-24

US6652710B2	2003-11-25
JPH11204499A	1999-07-30
US5711843A	1998-01-27
US6952657B2	2005-10-04
US6017414A	2000-01-25

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