METHOD FOR OPERATING VACUUM PROCESSOR

WIPO Patent Application WO/2022/064623

A1

A method for operating a vacuum processing device that sequentially processes a plurality of wafers, said vacuum processing device comprising: a plurality of longitudinally positioned vacuum transport containers that are connected in adjacent pairs, a transfer robot that transports wafers to be processed being positioned in an internal transport chamber; a lock compartment within which the wafer is accommodated, said lock compartment being connected to the vacuum transport container arranged frontmost among the plurality of vacuum transport containers; and a plurality of processing units connected to each of the plurality of vacuum transport containers, processing being performed on the wafer positioned inside the vacuum container, wherein a step for cleaning the interiors of each of the plurality of processing units is implemented after a prescribed period has elapsed. A plurality of sets of processing units that process individual wafers are set in advance from among the plurality of processing units before wafer processing is commenced, and the wafers start to be processed in prescribed periods of delay in sequence from the highest number of processing units included among the plurality of sets of processing units, and in sequence from the included processing unit farthest from the lock chamber.

NAIKI DAICHI (JP)
SUEMITSU YOSHIRO (JP)
NUMATA SHINICHIRO (JP)

PCT/JP2020/036165

March 31, 2022

September 25, 2020

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HITACHI HIGH TECH CORP (JP)

H01L21/677

JP2016213393A	2016-12-15
JP2013080812A	2013-05-02
JPH10189687A	1998-07-21
US8906163B2	2014-12-09
JP2011124564A	2011-06-23
JP2013207013A	2013-10-07

POLAIRE I.P.C. (JP)

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