Title:
METHOD AND PAD FOR POLISHING WAFER
Document Type and Number:
WIPO Patent Application WO/2003/038882
Kind Code:
A1
Abstract:
A method for polishing a wafer capable of effectively preventing the outer peripheral part of the wafer from sagging and a pad for polishing a wafer suitably used for the method of polishing the wafer, the method comprising the step of allowing the principal plane of the wafer to come into slidable contact with the polishing pad formed of nonwoven fabric soaked with resin to mirror-finish the surface, wherein the ratio of the surface roughness to the compressibility of the polishing pad [surface roughness Ra (µm)/compressibility (%)] is 3.8 or more.
Inventors:
MASUMURA HISASHI (JP)
TOMII KAZUYA (JP)
ITO SHIGENAO (JP)
ANZAI KENICHI (JP)
INOUE KENICHI (JP)
TOMII KAZUYA (JP)
ITO SHIGENAO (JP)
ANZAI KENICHI (JP)
INOUE KENICHI (JP)
Application Number:
PCT/JP2002/011094
Publication Date:
May 08, 2003
Filing Date:
October 25, 2002
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
RODEL NITTA COMPANY (JP)
MASUMURA HISASHI (JP)
TOMII KAZUYA (JP)
ITO SHIGENAO (JP)
ANZAI KENICHI (JP)
INOUE KENICHI (JP)
RODEL NITTA COMPANY (JP)
MASUMURA HISASHI (JP)
TOMII KAZUYA (JP)
ITO SHIGENAO (JP)
ANZAI KENICHI (JP)
INOUE KENICHI (JP)
International Classes:
B24B1/00; B24B7/30; B24B37/20; B24B37/24; B24D13/14; H01L21/304; H01L21/306; (IPC1-7): H01L21/304
Foreign References:
| JP2001261874A | 2001-09-26 | |||
| JPH10128674A | 1998-05-19 | |||
| JP2001019897A | 2001-01-23 |
Attorney, Agent or Firm:
Ishihara, Shoji (Wakai Bldg. 7-8, Higashi-Ikebukuro 3-chom, Toshima-ku Tokyo, JP)
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