METHOD FOR POLISHING SILICON WAFER AND POLISHING LIQUID THEREFOR

WIPO Patent Application WO/2011/135949

A1

Disclosed is a method for polishing a silicon wafer, wherein a surface to be polished of a silicon wafer is lapped, while supplying a polishing liquid, which is obtained by adding a water-soluble polymer to an aqueous alkaline solution that contains no free abrasive grains, to a polishing cloth. Consequently, the surface to be polished can be polished at high polishing rate and the flatness of the edge portion including roll-off and roll-up can be controlled.

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OGATA Shinichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
緒方　晋一 (〒34 東京都港区芝浦一丁目２番１号　株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
TANIMOTO Ryuichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
谷本　竜一 (〒34 東京都港区芝浦一丁目２番１号　株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)

JP2011/056881

November 03, 2011

March 23, 2011

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SUMCO CORPORATION (2-1 Shibaura 1-chome, Minato-ku Tokyo, 34, 〒1058634, JP)
株式会社ＳＵＭＣＯ (〒34 東京都港区芝浦一丁目２番１号 Tokyo, 〒1058634, JP)
OGATA Shinichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
緒方　晋一 (〒34 東京都港区芝浦一丁目２番１号　株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
TANIMOTO Ryuichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)

H01L21/304; B24B37/00; C09K3/14

ABE Itsurou (ABE International Patent Office, Complete Sakaimachi BLDG. 403 9-6, Sakaimachi 1-chome, Kokurakita-ku, Kitakyushu-sh, Fukuoka 05, 〒8020005, JP)

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