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Title:
METHOD FOR POLISHING SILICON WAFER, AND POLISHING SOLUTION FOR USE IN THE METHOD
Document Type and Number:
WIPO Patent Application WO/2012/005289
Kind Code:
A1
Abstract:
A surface to be polished of a silicon wafer is roughly polished while supplying a polishing solution prepared by adding a water-soluble polymer to an aqueous alkaline solution of abrasive grains to a hard polishing cloth. Therefore, the polishing at a high polishing rate and the roll-off of the outer peripheral part of the wafer can be achieved simultaneously.

Inventors:
TANIMOTO Ryuichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
谷本 竜一 (〒34 東京都港区芝浦一丁目2番1号 株式会社SUMCO内 Tokyo, 〒1058634, JP)
OGATA Shinichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
緒方 晋一 (〒34 東京都港区芝浦一丁目2番1号 株式会社SUMCO内 Tokyo, 〒1058634, JP)
GOTOU Isamu (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
Application Number:
JP2011/065476
Publication Date:
January 12, 2012
Filing Date:
July 06, 2011
Export Citation:
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Assignee:
SUMCO CORPORATION (2-1 Shibaura 1-chome, Minato-ku Tokyo, 34, 〒1058634, JP)
株式会社SUMCO (〒34 東京都港区芝浦一丁目2番1号 Tokyo, 〒1058634, JP)
TANIMOTO Ryuichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
谷本 竜一 (〒34 東京都港区芝浦一丁目2番1号 株式会社SUMCO内 Tokyo, 〒1058634, JP)
OGATA Shinichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
緒方 晋一 (〒34 東京都港区芝浦一丁目2番1号 株式会社SUMCO内 Tokyo, 〒1058634, JP)
International Classes:
H01L21/304; B24B37/00; B24B37/04
Attorney, Agent or Firm:
ABE Itsurou (ABE International Patent Office, Complete Sakaimachi BLDG. 403 9-6, Sakaimachi 1-chome, Kokurakita-ku, Kitakyushu-sh, Fukuoka 05, 〒8020005, JP)
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Claims: