Title:
METHOD FOR POLISHING SUBSTRATE PROVIDED WITH FUNCTIONAL CHIP
Document Type and Number:
WIPO Patent Application WO/2019/049659
Kind Code:
A1
Abstract:
A polishing end-point position is detected in order to end polishing at an appropriate position. According to one embodiment of the present invention, a method for chemically and mechanically polishing a substrate provided with a functional chip is provided. This method has: a step for placing a functional chip on a substrate; a step for placing an end-point detection element on the substrate; a step for sealing the substrate on which the functional chip and the end-point detection element are placed with an insulating material; a step for polishing the insulating material; and a step for detecting a polishing end point on the basis of the end-point detection element when the insulating material is polished.
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Inventors:
TOGAWA TETSUJI (JP)
SOBUKAWA HIROSHI (JP)
HATAKEYAMA MASAHIRO (JP)
SOBUKAWA HIROSHI (JP)
HATAKEYAMA MASAHIRO (JP)
Application Number:
PCT/JP2018/030894
Publication Date:
March 14, 2019
Filing Date:
August 22, 2018
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/304; B24B37/013; B24B49/04; B24B49/10; B24B49/12; B24B49/16
Foreign References:
| JP4056854B2 | 2008-03-05 | |||
| JP3141939B2 | 2001-03-07 | |||
| JP2000124601A | 2000-04-28 | |||
| US20150258657A1 | 2015-09-17 | |||
| JP6005467B2 | 2016-10-12 |
Attorney, Agent or Firm:
ONO, Shinjiro et al. (JP)
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