Title:
METHOD FOR POLISHING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/171312
Kind Code:
A1
Abstract:
The present invention relates to a method for polishing a substrate such as a wafer. This method for polishing a substrate involves rotating a substrate (W) about the axis while moving the substrate(W) and a polishing head (10C) in a relative circular motion, pressing, with the polishing head (10C), a polishing tape (2B) against a surface (5a) to be polished while feeding the polishing tape (2B) in the longitudinal direction, and polishing a center region including a center (O1) of the substrate (W) and an outer region adjacent to the center region. The step for polishing the center region and the outer region includes at least two polishing steps that are performed under different polishing conditions. The at least two polishing steps include a low polishing rate step that is performed under polishing conditions in which the polishing rate of the center region is lower than that of the outer region, and a high polishing rate step that is performed under polishing conditions in which the polishing rate of the center region is higher than that of the outer region.
Inventors:
YAMAMOTO SATORU (JP)
UCHIYAMA KEISUKE (JP)
KASHIWAGI MAKOTO (JP)
FUJISAWA MAO (JP)
UCHIYAMA KEISUKE (JP)
KASHIWAGI MAKOTO (JP)
FUJISAWA MAO (JP)
Application Number:
PCT/JP2023/005648
Publication Date:
September 14, 2023
Filing Date:
February 17, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B21/06; B24B21/00; H01L21/304
Foreign References:
| JP2019110266A | 2019-07-04 | |||
| JP2019077003A | 2019-05-23 | |||
| JP2011161625A | 2011-08-25 | |||
| JP2018094715A | 2018-06-21 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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