Structures

Technical Field

The invention is in the field of manufacturing of a workpiece's surface such as for example an embossing tool, which is designed to carry on the surface micro-structures and to emboss the micro-structures, the latter corresponding in their shape(s) to discrete or arrays of micro-optics components (e.g. microlenses), to individual or arrays of micro-channels (e.g., as used in microfluidics or in chip-on-lab type of biological analyses), to conductive micro-traces (e.g., as used in printed electronics), to name a few examples. More precisely, the invention relates to the polishing of a workpiece's surface carrying the micro-structures.

Prior Art

US publication US 2018/0169791 to Miller discloses a system for polishing an optical element with a femtosecond laser beam. The aim of the system is to achieve optical smoothness on a surface of the optical element. The laser system generates converging laser pulses with a pulse duration of less than 900 femtosecond and a relative 3-dimensional positioning of the surface of the optical element and the femtosecond laser beam is controlled by a controller, such that an intensity of the femtosecond laser beam at the surface of the optical element is sufficient to ablate matter at the surface, and a waist of the femtosecond laser beam is outside the optical element and 0,5 - 2,0 Rayleigh lengths away from the surface.

The prior art US publication clearly states that the disclosed polishing method relies on the matter removal from the surface to be polished, and further states that previously used polishing methods (without mentioning any details) involving a femtosecond laser produced surfaces that retained a certain level of roughness, no matter how many times the surface was treated.

As mentioned for the system disclosed in US publication US 2018/0169791, the Rayleigh length is generally defined as the distance along the propagation direction of a laser beam from its focus waist to

SUBSTITUTE SHEET (RULE 26) the plane, where the beam width increases with a factor V2. In the particular case of a laser beam passing through a focusing lens, the Rayleigh length is defined with respect to the beam's focus waist after the lens, i.e., to the focusing plane, and it gives a direct indication on the focusing depth. A laser beam with a longer Rayleigh length diverges slowly after the focusing lens, i.e., its fluence remains substantially constant over a longer path on its propagation. The criterion of optical smoothness corresponds in US publication US 2018/0169791 to a surface roughness of Ra = 10 nm or better, while the initial roughness is around Ra = 50 nm before polishing. One example of an optical element being polished is that of a surface of a contact lens, which can be a scleral contact lens or a hard contact lens customized for a particular wearer's eyeball shape. Such scleral contact lens or hard contact lens may have a size of around 15 mm in diameter and a base curve between 8 and 10 mm. The surface of the scleral contact lens or hard contact lens is continuously positioned by means of the controller such that a focus waist of the femtosecond laser beam remains outside the optical element and 0,5 - 2,0 Rayleigh lengths away from the surface.

In the following, a workpiece is understood to be a working tool, such as an embossing roller or a flat solid surface, or a moulding tool. The workpiece may be integrally made of a hard material or alternatively covered by a layer of the hard material, and hence a workpiece's surface is made out of the hard material. The hard material may be carved or otherwise structured to form micro-structures.

An optical micro-component is a discrete optical element for the visible spectrum (wavelength in a range of roughly 400 nm to 700 nm), having a determined shape and determined geometrical dimensions (height or depth in the range of 2 to 50 pm and width and/or length in a range of 5 to 100 pm), made of a transparent polymer material, designed to modify and transform an incident light according to known optical processes, such as waves propagation, refraction, diffraction.

The term of "preserving a shape" in the context of the present description means preserving the geometrical dimensions of an optical micro-component, that are essential to fulfill its function, for example the surface curvature radius for an optical micro-lens.

The invention seeks to provide a method and a system for polishing a workpiece's surface to optical-like smoothness while preserving a shape of existing micro-structures previously carved on the workpiece's surface, including height of depth dimensions, but also width of length dimensions. The micro-structures before polishing have a height or depth in the range of 2 to 50 pm and width and/or length in a range of 5 to 100 pm. The micro-structures are aimed for instance at an embossing or a moulding of optical

SUBSTITUTE SHEET (RULE 26) micro-components or at an embossing or a moulding of micro-channels for biological sensors or at an embossing or a printing of micro-circuits on electronic printed boards. Since the dimensions of the microstructures are orders of magnitude smaller than the size of a contact lens, a person skilled in the art departing from US publication US 2018/0169791, which is concerned only by the polishing of a contact lens, finds no description nor any suggestion about the possibility of preserving such a micro-structure's shape during a process of polishing. Also, US 2028/0169791 teaches to make use of the ablation phenomena, which would be deleterious for preserving any micro-structure, whereas the here disclosed invention relies on the melting and of the redistribution of the melted matter within a surface layer of the workpiece's surface being polished, which has an effect of improving a flatness of the workpiece's surface.

Summary Of the Invention

In a first aspect, the invention provides a method for a laser polishing of a workpiece's surface carrying at least one micro-structure protuberating from or penetrating in the workpiece's surface and the microstructure having a determined shape, whereby the workpiece's surface and the micro-structure are made from a same determined material and the laser polishing method being configured to substantially preserve at least the determined shape after its polishing. The method comprises focusing a pulsed femtosecond laser beam in a focus waist on or above the workpiece's surface at a distance in a range from 0 pm to 1 Rayleigh length on either side of the focus waist in a laser beam propagation axis, measured from the workpiece's surface, the laser beam impinging on the workpiece's surface in a spot; creating a relative movement at a determined scanning speed between the spot and the workpiece's surface configured to scan at least a part of the workpiece's surface, and of the at least one microstructure. The impinging laser beam heats the workpiece's surface or the at least one micro-structure, whereupon a determined number of successive pulses causes a melting layer zone of the determined material at the workpiece's surface which upon solidification improves the initial roughness of the workpiece's surface, and which is advanced over the workpiece's surface at the determined scanning speed (V) in order to polish the workpiece's surface. Each pulse of the laser delivers a determined fluence at the spot, to the workpiece's surface or the at least one micro-structure, that is below an ablation fluence threshold of the determined material. The melting layer zone is obtained by a partial superposition of the spots produced by corresponding successive pulses, the superposition which enables to reach a melting temperature of the determined material and form the melting layer zone. A pulse duration of pulses in the fs laser beam is greater or equal to 100 fs and inferior or equal to 2000 fs.

SUBSTITUTE SHEET (RULE 26) Thereby the method achieves a polishing and obtaining of the workpiece's surface and the at least one micro-structure with a roughness Ra of equal or greater than 100 nm.

In a preferred embodiment, a frequency of pulses in the fs laser beam is in the range of 10 MHz to 100 MHz.

In a further preferred embodiment, the creating a relative movement further comprises switching the laser beam on to illuminate the at least one part of the workpiece's surface, and of the at least one micro-structure, and otherwise switching the laser beam off.

In a further preferred embdoiment, the creating a relative movement further comprises switching the laser beam off in an edge zone that is configured to make a transition between the workpiece's surface and the at least one micro-structure.

In a further preferred embodiment, the method further comprises choosing the pulsed femtosecond laser to emit radiation with a wavelength in a range of 1030 nm to 1064 nm.

In a further preferred embodiment, the method further comprises configuring the pulsed femtosecond laser and the focusing such to obtain at the spot a pulse energy of the laser beam interacting with the surface in a range between 0,1 pJ and 5 pJ, and a diameter of the spot is in a range from 10 pm to 100 pm.

In a further preferred embodiment, the method further comprises configuring the relative movement to scan line by line in a grid-like pattern.

In a further preferred embodiment, the method further comprises setting the determined scanning speed in a range between 1 m/s and 10 m/s.

In a further preferred embodiment, the at least one micro-structure has a height above the workpiece's surface or depth inside the workpiece's surface equal to or greater than 2 pm and smaller than or equal to 50 pm, and lateral dimensions equal to or greater than 5 pm and smaller than or equal to 100 pm.

In a further preferred embodiment, the at least one micro-structure has its determined shape configured to be a constituent of any one of the list comprising a discrete micro-optics component, an array of micro-optics components, an array of optical micro-lenses, an individual micro-channel, an array of micro-channels, a conductive micro-trace, a grid of conductive micro-traces.

SUBSTITUTE SHEET (RULE 26) In a further preferred embodiment, the determined material out of which the workpiece's surface and micro-structures are made is any one of the list comprising hard ceramic, Diamond-Like Coating (DLC), Tantalum Carbide (TaC), CrN, TiN, a metal, a metallic alloy, such as for example a steel alloy, bulk or electroplated chromium or copper, electroplated nickel.

In a further preferred embodiment, an initial roughness Ra is in a range between 0,5 pm and 2,0 pm.

In a further preferred embodiment, the melting layer zone is a thin layer having a thickness d in a range of 0,5 pm to 1 pm.

In a second aspect, the invention provides a system for polishing of a workpiece's surface carrying at least one micro-structure protuberating from or penetrating in the workpiece's surface and the microstructure having a determined shape, whereby the workpiece's surface and the micro-structure are made from a same determined material; and the system for polishing being configured to preserve at least the determined shape after its polishing. The system comprises a pulsed femtosecond laser; a focusing lens configured to focus the pulsed femtosecond laser beam in a focus waist on or above the workpiece's surface at a distance in a range from 0 pm to 1 Rayleigh length on either side of the focus waist, in a laser beam propagation axis, measured from the workpiece's surface, and to make the laser beam impinge on the workpiece's surface in a spot; a workbench configured to hold the workpiece; and a positioning system configured to create a relative movement at a determined scanning speed between the spot and the workpiece's surface on the workbench, to scan the workpiece's surface, with the spot, including the at least one micro-structure. The system for polishing is further configured such that the impinging beam heats the workpiece's surface or the at least one micro-structure, whereby a determined number of successive pulses causes a melting layer zone of the determined material at the workpiece's surface, which is advanced over the workpiece's surface at the determined scanning speed in order to polish the workpiece's surface; each pulse of the laser delivers a determined fluence at the spot to the workpiece's surface, that is below an ablation fluence threshold of the determined material. The positioning system is further configured to enable the melting layer zone by a partial superposition of the spots produced by corresponding successive pulses, the superposition of which enables to reach a melting temperature of the determined material and form the melting layer zone. The system further comprises a laser controlling device configured to set a pulse duration of pulses in the fs laser beam to be greater or equal to 100 fs and inferior or equal to 2000 fs; and a frequency of pulses in the fs laser or beam.

SUBSTITUTE SHEET (RULE 26) In a further preferred embodiment, the laser controlling device enables to set the frequency of pulses in the range of 10 MHz to 100 MHz.

In a further preferred embodiment, the system for polishing further comprises a control unit configured to synchronise an on- and off-switching of the laser beam, with the relative movement of the workpiece carried out by the positioning system, and the control unit is enabled to switch the laser beam on and off according to a scanning strategy devised to illuminate the at least one part of the workpiece's surface, and the at least one micro-structure, and otherwise switch the laser beam off.

In a further preferred embodiment, the scanning strategy is further devised to leave an edge zone on the workpiece's surface, that is configured to make a transition between the workpiece's surface and the at least one micro-structure, un-polished by turning the laser off.

In a further preferred embodiment, the pulsed femtosecond laser is configured to emit radiation with a wavelength in a range of 1030 nm to 1064 nm.

In a further preferred embodiment, the pulsed femtosecond laser and the focusing lens are configured such to obtain at the spot a pulse energy of the laser beam interacting with the surface in a range between 0,1 pJ and 5 pJ; and a diameter of the spot is in a range from 10 pm to 100 pm.

In a further preferred embodiment, the positioning system is further configured to create the relative movement to scan line by line in a grid-like pattern.

In a further preferred embodiment, the positioning system is further configured to set the determined scanning speed in a range between 1 m/s and 10 m/s.

In a further preferred embodiment, the step of heating with the impinging laser beam causes a melting layer zone in form of a thin layer having a thickness d in a range of 0,5 pm to 1 pm.

Brief Description of the Drawings

The invention will be better understood through the detailed description of preferred embodiments of the invention, and in reference to the appended drawings, wherein figures 1A and IB contain graphs which illustrate a process by which a melting temperature is reached in material of a workpiece's surface and micro-structures carried thereon;

SUBSTITUTE SHEET (RULE 26) figures 2A, 2B, 2C and 2D are used to illustrate a profile cross-section through the laser polishing respectively of a plane surface and of a workpiece's surface carrying micro-structures according to examples of the invention; figure 3 illustrates two scanning patterns of a workpiece's surface according to an example embodiment of the invention; figure 4 schematically illustrates the high spatial overlap of subsequent laser pulses along the polishing path, according to an example of the invention; figure 5 schematically illustrates an example of polishing that preserves edge zones of micro-structures according to a preferred embodiment of the invention; figure 6 contains a flowchart illustrating a method of laser polishing according to an example embodiment of the invention; and figure 7 contains a schematic illustration of a system for polishing of a workpiece's surface with at least one micro-structure according to an example embodiment of the invention.

Same references are used throughout the figures to reference same of similar features.

Detailed Description of Preferred Embodiments of the Invention

It has been found that maintaining a fixed distance to the workpiece's surface surrounding the microstructures, in the field of 0 to 1,0 Rayleigh length allows to apply a substantially constant fluence to the workpiece's surface and to the micro-structures, even though the latter protrude from or penetrate in workpiece's surface. In other words, a distance needn't be adjusted when the polishing laser beam passes over a micro-structure, i.e., it is not necessary to use the controller from the prior art to monitor and maintain the focus waist of the femtosecond laser beam outside of the surface micro-structures, i.e., the workpiece's surface and the surface of the micro-structures. The adjustment is only made once in relation to the workpiece's surface.

A laser polishing set-up is used to polish the workpiece's surface and the micro-structures carried thereon.

SUBSTITUTE SHEET (RULE 26) An initially structured workpiece's surface, before polishing, comprises micro-structures with a height above the workpiece's surface or depth inside the workpiece's surface

• equal to or greater than 2 pm and

• smaller than or equal to 50 pm, and lateral dimensions

• equal to or greater than 5 pm and

• smaller than or equal to 100 pm.

The micro-structures possess properties that depend on their respective shapes, typically shapes of micro-optical components, diffractive gratings, mirror-like reflecting surfaces, etc. The shapes are paramount for the envisaged use of the embossings, or mouldings achieved with the micro-structures.

The material out of which the workpiece's surface and the micro-structures are made may be for example hard ceramic, for example hard ceramic of the type DLC (Diamond-Like Coating), TaC (Tantalum Carbide), CrN, TiN...

In a further preferred embodiment, the material may be a metal, a metallic alloy, such as for example a steel alloy, bulk or electroplated chromium or copper, electroplated nickel...

The micro-structures are initially rough, with a roughness of about 0,8 - 1,0 pm, as a result of the structuring of the workpiece's surface, for example by carving. This makes it necessary to proceed to a polishing process in order for the micro-structures to be usable in the end application, i.e., embossing of moulding thereof to obtain optical components.

It turns out that a mechanical polishing is impossible because the dimensions of the micro-structures are too small, and the respective shapes of the micro-structures too varied from one to the other. It is important that the polishing guarantees a determined result for a final shape of each micro-structure.

A polishing making use of a continuous wave CO ₂ laser is a commonly used technique. However, the workpiece's zone that is thermally affected in this technique is too large for the end application in that embossing or moulding of the polished micro-structure(s) doesn't allow to obtain the desired micro- optical components. In addition, the thermally affected zone may alter physical and chemical properties of the hard ceramics, out of which the micro-structures are made. This is for example the case for DLC

SUBSTITUTE SHEET (RULE 26) where the effect of the temperature may alter a larger and more significant part of the hard ceramic in its quality, and reduce its hardness.

It is therefore indicated to limit a melting zone as much as possible. In order to achieve this, femtoseconds lasers are used. These lasers are typically used for their precision in cutting or in fine material ablation, because the thermal effects are limited. The laser pulses are so energetic during ultrashort time lapses that the material is ablated at the beam incidence and that only little heat is produced in the workpiece. In order to use these lasers in a melting mode, the lasers are adjusted in such a manner that the fluence of a single pulse does not exceed the maximum fluence before ablation of the material out of which the micro-structure is made. It is then necessary to set the shooting frequency of the laser, typically in the 10 MHz and 100 MHz-range in order to transfer some heat to the surface to be melted. The heat accumulates and makes the material melt at the surface on a very little depth, i.e., a depth in the order of a pm thanks to the very high precision of the heat quantity delivered by each pulse.

Figures 1A and IB are used to illustrate the process by which a melting temperature 103 of the material of a workpiece's surface and micro-structures carried thereon, is reached while staying below of the fluence threshold for ablation. In figure 1A one graph shows the laser fluence for 2 laser pulses 100 at a pulse frequency f ₀ , and how the fluence remains below an ablation threshold 101 of the material, while the other graph shows a surface temperature over time 102 at the workpiece's surface, and also the melting temperature threshold 103 of the material. The correspondence between the two graphs for the pulses is shown by dotted lines 104 connecting the two graphs. In a first case of figure 1A the frequency fo of the laser is too small, for example around 0,2 MHz, and since the fluence remains below the fluence of ablation threshold 101, the material never reaches its melting temperature 103. The polishing effect may not be obtained. In figure IB one graph shows the laser fluence for 4 laser pulses 105 at a pulse frequency f which may be 50 to 100 times greater than f ₀ , e.g., between 10 MHz and 100 MHz, preferably 50 MHz, and how this remains below the ablation threshold 101, while the other graph shows the temperature over time 106 at the workpiece's surface, and also the melting temperature threshold 103. In the second case of figure IB where the frequency f of the laser is in the 10 MHz to 100 MHz range, the laser pulses are close enough from each other that the heat released by one pulse to the workpiece's surface may not dissipate before the next pulse arrives. Hence the surface temperature at the surface of the workpiece rises gently until it reaches 107 the melting temperature 103, despite the fact that the fluence of each pulse is below the fluency of ablation threshold. Following the reaching 107

SUBSTITUTE SHEET (RULE 26) of the melting temperature, the melting persists 108 for consecutive laser pulses (not illustrated in figure IB).

Figures 2A, 2B, 2C, and 2D are used to illustrate a profile cross-section through the laser polishing respectively of a plane surface and of a workpiece's surface carrying micro-structures according to preferred embodiments of the invention. The initially unpolished workpiece's surface 200 has an initial roughness that the polishing process aims to reduce. The initial roughness Ra may be in a range between 0,5 pm and 2,0 pm. The laser beam 201 passes through a focusing lens (not illustrated in the figures) and it is un-focused relatively to the workpiece's surface 200 by a height Z which is smaller than a Rayleigh length Z _R , i.e., the height Z must remain equal to or below the Rayleigh length Z _R , and would typically be set at around Z = 0,5 x z _R . This allows to melt a melting layer zone 204 of the workpiece's 203 surface 200 under the laser beam 201. It is noted that the Rayleigh length Z _R is not represented in proper proportions in the figures, this having been done deliberately for a better readability.

In preferred embodiments, the value of Z may be any one of items in the list comprising at least the following values in pm: 0, 50, 100, 200, 400.

The melt layer zone 204 is advanced in direction of speed V along the workpiece's surface 200 in order to polish it, this process leaving a thin layer 205 affected by the heat, the thin layer 205 having a thickness d of a few hundred nanometers to 1 pm, depending mainly on laser parameters and values of speed of advancing V.

The femtosecond laser has a wavelength in the range of 1030 nm to 1064 nm (not illustrated in the figures). A pulse duration of the laser is in the range of 100 fs to 2000 fs. A frequency of the laser is in the range of 10 MHz and 100 MHz. An average power of the laser on the workpiece's surface 200 is dependent on the fluence to be reached on the surface. It is important not to reach the threshold ablation fluence over which ablation happens, or in other words, the ablation threshold, as illustrated in figures 1A and IB with reference 101. In a preferred example embodiment, a focusing lens (not illustrated in figures 2A, 2B, 2C and 2D) causes the laser beam 201 to converge on a spot 207 and to have a focus waist 210 of for example 2 x w ₀ = 25 pm, wherein w ₀ corresponds to half of the focus waist's diameter, and this produces a depth of focusing in the order of for example 950 pm, corresponding to twice the Rayleigh length Z _R (2Z _R = (27TWO )/(A)). An incidence angle of the laser beam 201 remains constant, i.e., it doesn't change as a function of any micro-structure 206's shapes on the workpiece's surface 200. The laser beam 201 remains incident perpendicularly to the workpiece's surface 200.

SUBSTITUTE SHEET (RULE 26) The laser beam 201 may be de-focused relative to the workpiece's surface 200. In a further preferred embodiment, a focal point 210 is located at the height Z in a range from 0 pm to 500 pm from the workpiece's surface 200 to polish. A particularly advantageous result is obtained at a de-focusing distance of substantially 200 pm.

The micro-structures 206 have a height h. The Rayleigh length Z _R is adjusted such that the whole of height h remains in the laser beam 201 in an area of the laser beam 201 delimited by the Rayleigh length Z _R , on both sides of the focus waist 210 in direction of the laser beam 201, at all times. As illustrated in figure 2D, for a case in which the height Z is smaller than the height h of the micros-structures 206, the whole of height h still remains in the laser beam 201 in the area of the laser beam 201 delimited by the Rayleigh length Z _R , on both sides of the focus waist 210, the focus waist 210 being located in the height h of the micro-structure 206 at a time when the laser beam 201 scans the micro-structure 206. A fluence in the laser beam measured anywhere in the interval of the 2 Rayleigh lengths Z _R on both sides of the focus waist 210 is sufficient to obtain a constant polishing quality.

While figure 2B represents micro-structures 206 which protuberate from the workpiece's surface 200, and have a convex shape, figure 2C represents micro-structures 206 which penetrate in the workpiece's surface 200 and have a concave shape.

The workpiece's surface and the micro-structures are scanned line by line in a grid-like pattern 305 as illustrated in figure 3. The grid-like pattern 305 in this example is presented by 5 lines 300 to 304, whereby a scanning direction is represented by corresponding arrows.

In a preferred embodiment, the scanning may also be done by scanning each line 300 to 304 in each opposite direction, i.e., back and forth, before proceeding to a next line, e.g., to the next adjacent line. This is not illustrated in figure 3.

A scanning speed or speed of advancing V may for example be between 1 m/s and 10 m/s in order to obtain a superposition of successive laser pulses as schematically represented in figure 4, which illustrates the superposition of multiple laser spots 400i to 400 _N forming an oval shaped illumination pattern 401. The greater or higher the superposition is, the higher the maximal temperature in the material illuminated (material not illustrated) gets. A scanning speed may need to be dependent on the material of the workpiece's surface and its micro-structures, and on the desired result, i.e., the desired polishing roughness.

In a preferred embodiment, following parameters are used or achieved:

SUBSTITUTE SHEET (RULE 26) • the polishing spot moves with 0,1 pm between two adjacent spots corresponding to two successive laser pulses; in term of overlap, there is an overlap of 99.6% between two adjacent spots. In other words, when considering the illustration of figure 4, this means that the distance between two adjacent spots 400, and 400i+i is 0,1 pm as measured from a displacement of the spots' centers (not illustrated in figure 4);

• for a 25 pm path along a polishing path, one may need 5 ps, leading to a value of 250 successive pulses that impinge on the workpiece's surface during this time interval;

• an incident fluence is 0,06 J/cm ² . However, values between 0,01 J/cm ² and 0,1 J/cm ² may alternatively also be used, as long they do not reach the ablation threshold of the workpiece's material;

• the laser beam scans twice the workpiece's surface to be polished, e.g., each scanning line is scanned back and forth before passing to a next adjacent scanning line; an increasing of the number of passes of the laser beam over the workpiece's surface above this twice scanning, may not yield any further improvement of the polishing result.

One advantage of the laser polishing according to the invention is that a workpiece's surface microtopography doesn't need to be followed and continuously adjusted in order to polish the microstructures 206, in case the height h of the micro-structures 206 remains below 500 pm. In one of the preferred embodiments described herein above, this height h approximately corresponds to the Rayleigh length Z _R .

The laser polishing according to the invention has a further advantage in that it preserves the determined shape of each of the micro-structures 206. The micro-structures 206 may correspond to micro-optical components to be embossed or moulded, and each may have the shape of microcomponents with respective curve(s). Alternatively, the determined shape may be that of a discrete micro-optics component, an array of micro-optics components, an array of optical micro-lenses, an individual micro-channel, an array of micro-channels, a conductive micro-trace.

If the profiles of the micro-structures are compared from before and after the laser polishing, a change of an edge zone that is configured to make a transition between the workpiece's surface and the microstructure may be affected by the polishing.

In order to prevent the change of shape in the edge zone, in a preferred embodiment illustrated in figure 5, the polishing laser beam 201 selectively impinges, e.g., by being turned on and off as appropriate,

SUBSTITUTE SHEET (RULE 26) during scanning according to the speed V, on micro-structures 500 previously carved in the workpiece's surface 200 (similar to the micro-structures 206 in figure 2C), starting at 201 (1) respectively 201 (3)), and ending at 201 (2) respectively 201 (4), hence polishing the micro-structures 500 between the edge zones 501. The edge zones 501 measure preferably 10 pm, most preferably 5 pm away from sharp edges 502. By doing this, the polishing effect is fully effective on rounded parts of the micro-structures 500 and there is no laser melting effect in the region of sharp edges 502 and edge zones 501 - which keeps its initial roughness and doesn't modify its geometrical dimensions. As an example, for a given carved micro-lens, the diameter of the circular zone, where the laser beam 201 impinges may comprise 60% of the micro-lens diameter. The starting and ending of the polishing may be obtaining by switching the laser beam on and off respectively.

Returning to figure 3, circles 306, 307 and 308 schematically represent locations of individual microstructures on a workpiece's surface. Their respective magnified view each show the scanning lines of the laser beams, whereby each arrow therein represents a section of the laser scanning, each section during which the laser is on and polishes the micro-structure. Hence the laser is off in the edge zone 501.

Figure 6 contains a flowchart illustrating an example embodiment of a method for a laser polishing of a workpiece's surface carrying at least one micro-structure 600 protuberating from or penetrating in the surface and having a determined shape according to the invention. Further the workpiece's surface and the micro-structure are made from a same determined material. The laser polishing method is configured to preserve at least the determined shape. The method comprises a step of focusing 601 a pulsed femtosecond laser beam on or above the workpiece's surface at a distance in the range from 0 pm to the Rayleigh length from the workpiece's surface, the laser beam impinging on the workpiece's surface in a spot. The method further comprises a step of creating a relative movement 602 at a determined scanning speed between the spot and the workpiece's surface to scan the workpiece's surface, with the spot, including the at least one micro-structure, and a step of heating 603 with the impinging laser beam the workpiece's surface or the at least one micro-structure, whereby a determined number of successive pulses causes a melting layer zone of the determined material at the surface, which is advanced over the workpiece's surface of the determined material at the determined scanning speed in order to polish the workpiece's surface. In the method each pulse of the laser delivers a determined fluence at the spot to the surface, that is below an ablation fluence threshold of the determined material; the melting layer zone is obtained by the partial superposition of the spots produced by corresponding successive pulses, the superposition which enables to reach a melting

SUBSTITUTE SHEET (RULE 26) temperature of the determined material. Thereby a polished workpiece's surface and the at least one micro-structure 604 with a roughness as low as 100 nm (R _a value) are obtained.

Referring now to figure 7, this illustrates schematically a system for polishing 700 of a workpiece 203's surface 200 with at least one micro-structure 206 protuberating from the workpiece's surface 200 according to an example embodiment of the invention. The micro-structure 206 has a determined shape. As previously stated, the workpiece's surface 200 and the micro-structure(s) 206 are made from a same determined material. The system for polishing 700 is configured to preserve the determined shape after its polishing. The system for polishing 700 comprises a pulsed femtosecond laser 701, a focusing lens (not illustrated in the figure) configured to focus the pulsed femtosecond laser beam 201 on or above the workpiece's surface 200 at a distance in the range from 0 pm to a Rayleigh length (not illustrated in the figure) in the laser beam 201, measured from the workpiece's surface, and make the laser beam 201 impinge on the workpiece's surface in a spot (not illustrated in the figure). The system 700 further comprises a workbench 702 configured to hold the workpiece 203, and a positioning system 703 configured to create a relative movement at a determined scanning speed between the spot and the workpiece's surface on the workbench, to scan the workpiece's surface 200, with the spot, including the at least one micro-structure 206. The system for polishing 700 is further configured such that the impinging beam heats the workpiece's surface or the at least one micro-structure, whereby a determined number of successive pulses causes a melting layer zone (not illustrated in the figure) of the determined material at the workpiece's surface, which is advanced over the workpiece's surface at the determined scanning speed in order to polish the workpiece's surface. Each pulse of the laser delivers a determined fluence at the spot to the workpiece's surface, that is below an ablation fluence threshold of the determined material. The positioning system 703 is further configured to enable the melting layer zone by a partial superposition of the spots produced by corresponding successive pulses, the superposition which enables to reach a melting temperature of the determined material and form the melting layer zone. The system 700 further comprises a laser controlling device 704 configured to set a pulse duration of pulses in the fs laser beam to be greater or equal to 100 fs and inferior or equal to 2000 fs, and a frequency of pulses in the fs laser or beam in the range 10 MHz and 100 MHz. The system for polishing further comprises a control unit 705 configured to synchronise the on- and off-switching of the laser beam 201 with the relative movement of the workpiece 206 carried out by the positioning system 703.

SUBSTITUTE SHEET (RULE 26) In a preferred embodiment, the scanning movement and the scanning speed can be generated by keeping the laser beam 201 and focusing system 701 fixed and by moving the workbench 702 in front of the laser beam, or alternatively by moving the focused laser beam 201 delivered by 701 on the workpiece's surface 200 kept fixed by the positioning system 703, or by combinations thereof. In a preferred embodiment, where the workpiece 203 is an embossing roller, the laser beam 201 executes a translation movement, whereas the positioning systems 703 rotates the workbench 702, hence the workpiece 203 (i.e., the roller) in front of the laser beam 201.

One advantage of the invention is that it enables the once at a time polishing of individual or of arrays of micro-structures at the time of manufacturing of the embossing or moulding tool. On the one hand, this grants that after the polishing step all the micro-structures will have similar surface roughness values and, on the other hand, eliminates the need to polish the individual micro-components obtained through the embossing with an unpolished embossing tool or through the moulding with an unpolished moulding tool.

A further advantage of the invention, in the preferable case when the carving of the micro-structures into the embossing or moulding tool is carried out using a laser beam, is that a manufacturing using the same laser machining facility and, more preferably, the same laser sources, i.e., without changeover, becomes possible. This simplifies the industrial production of polished embossing or moulding tools carrying micro-structures (for producing micro-components afterwards) and makes it more reliable, by avoiding misalignment errors.

SUBSTITUTE SHEET (RULE 26)