Title:
METHOD FOR POLISHING USING POLISHING PAD PROVIDED WITH ADSORPTION LAYER
Document Type and Number:
WIPO Patent Application WO/2018/225658
Kind Code:
A1
Abstract:
The present invention pertains to a method for polishing using a polishing pad provided with a prescribed adsorption layer. The polishing pad is provided with an adsorption layer that comprises, inter alia, silicone comprising a linear polyorganosiloxane having a vinyl base solely on the two terminal ends. In the present invention, after the polishing pad is fixed to a platen and when an object to be polished is polished by being slid while pressed against the polishing pad, the surface roughness (Ra) of the platen is set to 0.01-0.7 μm, and then the adsorption layer of the polishing pad is fixed by adsorption to the platen and a polishing operation is performed. Adjusting the surface roughness of the platen in this manner makes it possible to suppress unexpected scratching and/or roughening of the surface of the object to be polished. Bonding a film having the above-described surface roughness to the surface of the platen is preferred as the method for adjusting the surface roughness of the platen.
Inventors:
YAJIMA TOSHIYASU (JP)
NINOMIYA DAISUKE (JP)
NINOMIYA DAISUKE (JP)
Application Number:
PCT/JP2018/021263
Publication Date:
December 13, 2018
Filing Date:
June 01, 2018
Export Citation:
Assignee:
MARUISHI SANGYO CO LTD (JP)
International Classes:
B24B37/22; B32B27/00; B32B27/12; H01L21/304
Foreign References:
| JP2014108498A | 2014-06-12 | |||
| JP3166396U | 2011-03-03 | |||
| JP2010201588A | 2010-09-16 | |||
| JP2014151410A | 2014-08-25 | |||
| JP2016171261A | 2016-09-23 | |||
| CN101298129A | 2008-11-05 |
Attorney, Agent or Firm:
TANAKA AND OKAZAKI (JP)
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