METHOD FOR PREPARING ADHESIVE-FREE, POLYIMIDE FLEXIBLE PRINTED CIRCUIT BOARD

Title:

METHOD FOR PREPARING ADHESIVE-FREE, POLYIMIDE FLEXIBLE PRINTED CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2017/016395

Kind Code:

A1

Abstract:

Provided is a method for preparing an adhesive-free, polyimide flexible printed circuit board. The method comprises the following steps: 1) placing a polyimide thin film into a low vacuum environment, and treating same using plasma produced by capacitively coupled discharge of an organic amine; 2) placing the polyimide thin film obtained in step 1) into a low vacuum environment, and pretreating same using plasma formed by capacitively coupled discharge of a nitrogen gas bubbled through a metal salt solution; 3) preplating the polyimide thin film obtained in step 2) using vacuum sputtering or chemical plating so as to obtain a dense copper film with a thickness of less than 100 nanometers; and 4) increasing the thickness of the copper film to a required thickness by means of an electroplating method. The method not only does not require an adhesive, but can also simplify the process, reduce human input and decrease costs, can decrease environmental pollution, and can be used for manufacturing an ultrathin adhesive-free, flexible printed circuit board.

Inventors:

MENG YUEDONG (CN)
CHANG PENG (CN)
CAI GANGQIANG (CN)

Application Number:

PCT/CN2016/090073

Publication Date:

February 02, 2017

Filing Date:

July 14, 2016

Export Citation:

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Assignee:

SUZHOU WEIPENG ELECTRICAL TECH CO LTD (CN)

International Classes:

H05K3/02; H05K3/38

Domestic Patent References:

WO2014092335A1

2014-06-19

Foreign References:

CN1189125A	1998-07-29
CN101313010A	2008-11-26
CN1272072A	2000-11-01
CN104228209A	2014-12-24
JPH04282844A	1992-10-07
US20030148078A1	2003-08-07

Other References: