Title:
METHOD FOR PREPARING ARRAY SUBSTRATE MOTHERBOARD, ARRAY SUBSTRATE MOTHERBOARD AND DETECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/001133
Kind Code:
A1
Abstract:
Provided in the present disclosure are a method for preparing an array substrate motherboard, an array substrate motherboard and a detection method. The method for preparing an array substrate motherboard comprises: depositing a first thin film on a base substrate, a first gap being present between the edge of the first thin film and the edge of the base substrate; coating photoresist on the base substrate on which the first thin film is deposited; and exposing and developing the photoresist so as to form a first scale pattern from the photoresist, one end of the first scale pattern being flush with the edge of the base substrate while the other end covers the first thin film.
Inventors:
FU FANGBIN (CN)
GUO HUIBIN (CN)
WANG SHOUKUN (CN)
HAN HAO (CN)
SONG YONGZHI (CN)
GUO HUIBIN (CN)
WANG SHOUKUN (CN)
HAN HAO (CN)
SONG YONGZHI (CN)
Application Number:
PCT/CN2018/085276
Publication Date:
January 03, 2019
Filing Date:
May 02, 2018
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE DISPLAY TECH CO (CN)
BEIJING BOE DISPLAY TECH CO (CN)
International Classes:
H01L27/12; H01L21/66
Foreign References:
| CN101078832A | 2007-11-28 | |||
| CN104637395A | 2015-05-20 | |||
| CN107195639A | 2017-09-22 | |||
| CN107039305A | 2017-08-11 |
Attorney, Agent or Firm:
CHINA PATENT AGENT (H.K.) LTD. (CN)
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