Title:
METHOD FOR PREPARING FILM LAYER SLEEVE HOLE AND ARRAY SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/129104
Kind Code:
A1
Abstract:
Provided in the present invention is a method for preparing a film layer sleeve hole: when preparing the film layer sleeve hole, fill a base hole with a substrate material before coating a photoresist layer, so as to prevent a larger photoresist thickness in the area from being caused by photoresist material depositing inside of the base hole while the photoresist layer is being coated; thus, the thickness of the photoresist layer may be reduced, thereby improving precision in controlling the line width of the sleeve hole.
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Inventors:
QI PENGBO (CN)
CHEN YEKAI (CN)
CHEN YEKAI (CN)
Application Number:
PCT/CN2018/124050
Publication Date:
July 04, 2019
Filing Date:
December 26, 2018
Export Citation:
Assignee:
WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
H01L21/77; G03F7/20; H01L27/12
Foreign References:
| CN107357104A | 2017-11-17 | |||
| CN1490867A | 2004-04-21 | |||
| CN108183088A | 2018-06-19 | |||
| KR20070073441A | 2007-07-10 | |||
| CN103081123A | 2013-05-01 | |||
| CN104538348A | 2015-04-22 | |||
| US20150179692A1 | 2015-06-25 |
Attorney, Agent or Firm:
ESSEN PATENT & TRADEMARK AGENCY (CN)
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