Title:
METHOD OF PREPARING POLISHING HEAD AND POLISHNG APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/119606
Kind Code:
A1
Abstract:
The present invention relates to a method of preparing a polishing head comprising a step of gluing to a rigid ring a rubber film made of rubber having at least 40-90 deg. of hardness in JIS A scale and a step of selecting the rubber film glued to the rigid ring attached to a backing plate, the bottom surface of the rubber film having the flatness of 40 μm or less as measured along the periphery thereof where the rubber film is glued to the rigid ring. The selected rubber film glued to the rigid ring attached to a backing plate is used for a polishing head. The polishing head thus prepared and the polishing apparatus accomplish a constant flatness and a constant polishing allowance.
Inventors:
HASHIMOTO, Hiromasa (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
橋本浩昌 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 半導体白河研究所内 Fukushima, 〒9618061, JP)
MASUMURA, Hisashi (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
桝村寿 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 半導体白河研究所内 Fukushima, 〒9618061, JP)
MORITA, Kouji (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
森田幸治 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 半導体白河研究所内 Fukushima, 〒9618061, JP)
橋本浩昌 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 半導体白河研究所内 Fukushima, 〒9618061, JP)
MASUMURA, Hisashi (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
桝村寿 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 半導体白河研究所内 Fukushima, 〒9618061, JP)
MORITA, Kouji (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
森田幸治 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 半導体白河研究所内 Fukushima, 〒9618061, JP)
Application Number:
JP2010/001629
Publication Date:
October 21, 2010
Filing Date:
March 09, 2010
Export Citation:
Assignee:
Shin-Etsu Handotai Co.,Ltd. (6-2 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町二丁目６番２号 Tokyo, 〒1000004, JP)
Fujikoshi Machinery Corp. (1650, Kiyono Matsushiro-machi, Nagano-sh, Nagano 33, 〒3811233, JP)
不二越機械工業株式会社 (〒33 長野県長野市松代町清野１６５０番地 Nagano, 〒3811233, JP)
HASHIMOTO, Hiromasa (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
橋本浩昌 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 半導体白河研究所内 Fukushima, 〒9618061, JP)
MASUMURA, Hisashi (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
桝村寿 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 半導体白河研究所内 Fukushima, 〒9618061, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町二丁目６番２号 Tokyo, 〒1000004, JP)
Fujikoshi Machinery Corp. (1650, Kiyono Matsushiro-machi, Nagano-sh, Nagano 33, 〒3811233, JP)
不二越機械工業株式会社 (〒33 長野県長野市松代町清野１６５０番地 Nagano, 〒3811233, JP)
HASHIMOTO, Hiromasa (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
橋本浩昌 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 半導体白河研究所内 Fukushima, 〒9618061, JP)
MASUMURA, Hisashi (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
桝村寿 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 半導体白河研究所内 Fukushima, 〒9618061, JP)
International Classes:
B24B37/04; H01L21/304
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)
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