Title:
METHOD FOR PREPARING POLYIMIDE FILM HAVING LOW DIELECTRIC CONSTANT AND HIGH FRACTURE TOUGHNESS
Document Type and Number:
WIPO Patent Application WO/2018/166242
Kind Code:
A1
Abstract:
The present invention discloses a method for preparing a polyimide film having a low dielectric constant and high fracture toughness. The method comprises: first preparing an aromatic diamine solution, and then grinding and well mixing a carbic anhydride-maleimido heptaisobutyl polysilsesquioxane alternating copolymer and aromatic dianhydride; adding the mixture to the aromatic diamine solution, and then stirring to obtain a carbic anhydride-maleimido heptaisobutyl polysilsesquioxane alternating copolymer/polyamide acid solution; uniformly applying the carbic anhydride-maleimido heptaisobutyl polysilsesquioxane alternating copolymer/polyamide acid solution to a clean glass sheet, and then placing the glass sheet in a vacuum drying cabinet for treatment; cooling the treated glass sheet to room temperature and then putting same in water for ultrasonic peeling of a film, and vacuum drying the film to obtain a target product. The dielectric constant of the film obtained in the present invention is reduced to 2.2, the breaking elongation is increased by 272%, and the tensile energy is increased by 285%, so that the breaking elongation and tensile energy are greatly increased, and thus the fracture toughness is good.
Inventors:
ZHAO JIANQING (CN)
CHEN ZHIGENG (CN)
LIU SHUMEI (CN)
ZHANG SEN (CN)
CHEN ZHIGENG (CN)
LIU SHUMEI (CN)
ZHANG SEN (CN)
Application Number:
PCT/CN2017/113882
Publication Date:
September 20, 2018
Filing Date:
November 30, 2017
Export Citation:
Assignee:
UNIV SOUTH CHINA TECH (CN)
International Classes:
C08F283/12; C08J5/18; C08G73/10; C08L79/08
Foreign References:
| CN106916324A | 2017-07-04 | |||
| CN104356413A | 2015-02-18 | |||
| CN105400196A | 2016-03-16 | |||
| JP2016124157A | 2016-07-11 |
Attorney, Agent or Firm:
GUANGZHOU HUAXUE INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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