Title:
METHOD FOR PRINTING LASER MARK, AND METHOD FOR MANUFACTURING SILICON WAFER WITH LASER MARK
Document Type and Number:
WIPO Patent Application WO/2021/024674
Kind Code:
A1
Abstract:
Provided are a method for printing a laser mark, and a method for manufacturing a silicon wafer with a laser mark, with which it is possible to reduce processing distortion that remains at the peripheral edge of dots constituting the laser mark. This method for printing a laser mark comprising a plurality of dots on a silicon wafer is characterized in that each of the plurality of dots is formed using laser light having a wavelength in the ultraviolet region.
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Inventors:
HIRAKAWA YOICHIRO (JP)
Application Number:
PCT/JP2020/026461
Publication Date:
February 11, 2021
Filing Date:
July 06, 2020
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
B23K26/00; H01L21/02; H01L21/304
Foreign References:
| JP2008504964A | 2008-02-21 | |||
| JP2000263840A | 2000-09-26 | |||
| JP2013093493A | 2013-05-16 | |||
| JP2011029355A | 2011-02-10 | |||
| JP2003188059A | 2003-07-04 | |||
| JP2000286173A | 2000-10-13 | |||
| JP2014036134A | 2014-02-24 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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