Title:
METHOD OF PROCESSING BRITTLE MATERIAL AND PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO2003018276
Kind Code:
B1
Abstract:
A method of processing a brittle material and a processing device, capable of allowing cracks occurring by laser beam irradiation to efficiently progress. A method of processing a brittle material comprising irradiating a brittle material W with a laser beam from a laser beam source while relatively moving its irradiation position along a scheduled processing line C on the surface of the material to thereby process the brittle material, wherein a cooling liquid film t is formed on the entire surface of the brittle material W to cool the material W, and, with a hole h made in the cooling liquid film t by spraying a gas a onto the surface of the material W kept open, while the laser beam L is applied to the surface of the material W exposed in this hole h, the irradiation position of a laser beam L and the spraying position of the gas a are moved along the scheduled processing line C to complete processing.
Inventors:
OTSU YASUHIDE (JP)
Application Number:
PCT/JP2002/008538
Publication Date:
April 10, 2003
Filing Date:
August 23, 2002
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
OTSU YASUHIDE (JP)
OTSU YASUHIDE (JP)
International Classes:
B23K26/12; B23K26/38; B23K26/40; B28D1/22; B28D5/00; C03B33/09; (IPC1-7): B28D5/00
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