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Patent Searching and Data


Title:
METHOD FOR PROCESSING ELECTRONIC AND ELECTRICAL DEVICE COMPONENT SCRAP
Document Type and Number:
WIPO Patent Application WO/2019/177176
Kind Code:
A1
Abstract:
Provided is a method for processing electronic and electrical device component scrap, with which it possible to selectively process, accurately and efficiently, electronic and electrical device scrap and the like. This method for processing electronic and electrical device component scrap is characterized by containing a separation step in which a sorter 10 comprising a metal sensor 2, a color camera 3, an air valve 4 and a conveyor 5 is used to separate non-metal materials 1b or metal materials 1a1 and 1a2 from electronic and electrical device component scrap 1 containing metal materials 1a1 and 1a2 and non-metal materials 1b, wherein when detecting the metal materials 1a1 and 1a2 in the electronic and electrical device component scrap using the metal sensor 2, a given interval is provided between the adjoining metal materials 1a1 and metal materials 1a2, to prevent non-metal materials 1b present between the metal materials 1a1 and metal materials 1a2 from being incorrectly detected.

Inventors:
AOKI KATSUSHI (JP)
TAKEDA TSUBASA (JP)
Application Number:
PCT/JP2019/011292
Publication Date:
September 19, 2019
Filing Date:
March 18, 2019
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C22B1/00; B09B5/00
Foreign References:
JP2013000685A2013-01-07
JP2000343044A2000-12-12
JP2004283729A2004-10-14
JP2001058138A2001-03-06
JP2002210417A2002-07-30
JP2001096261A2001-04-10
JP2009532198A2009-09-10
JP2012139609A2012-07-26
JP2017083348A2017-05-18
JPH0978151A1997-03-25
JP2015123418A2015-07-06
Other References:
See also references of EP 3766994A4
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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