METHOD OF PROCESSING HIGH-MODULUS POLYETHYLENE

Title:

METHOD OF PROCESSING HIGH-MODULUS POLYETHYLENE

Document Type and Number:

WIPO Patent Application WO/1989/002004

Kind Code:

A1

Abstract:

This invention aims at facilitating machining such as cutting, boring or the like, of high-modulus polyethylene by utilizing thermal properties thereof. In accordance with the method of the present invention, high-modulus polyethylene is heated to a temperature higher than the melting point of crystalline fibrils thereof before machining so that the heated portion of the polyethylene returns to the state before super-drawing and is easy to machine. Accordingly, a fabrication such as cutting, boring or the like can be carried out easily.

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Inventors:

URYU MASARU (JP)
NISHI YOSHIO (JP)
YAGI KAZUO (JP)

Application Number:

PCT/JP1988/000835

Publication Date:

March 09, 1989

Filing Date:

August 22, 1988

Export Citation:

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Assignee:

SONY CORP (JP)
MITSUI PETROCHEMICAL IND (JP)

International Classes:

B23P25/00; B26D7/10; D01F6/04; D06H7/00; (IPC1-7): D06H7/22

Foreign References:

JPS5545845A	1980-03-31
JPS58163776A	1983-09-28
JPS5327199U	1978-03-08

Other References: