METHOD FOR PROCESSING LAMINATED MEMBER

Title:

METHOD FOR PROCESSING LAMINATED MEMBER

Document Type and Number:

WIPO Patent Application WO/2017/130324

Kind Code:

A1

Abstract:

Crimping groups (13) having a plurality of crimping parts (14, 15) of different orientation are formed on a plurality of thin plates (10) that are disposed in an overlapping manner. After the positions of the overlapped thin plates (10) are fixed, a preset punching process is carried out on the thin plates (10), which are registered using pilot holes (12). This prevents misalignment of the overlapping plurality of thin plates (10) when the punching process is carried out on the thin plates (10), thereby making it possible to perform a high-accuracy punching process without the periphery of the pilot holes (12) being deformed due to pilot pins (11).

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Inventors:

HASHIMOTO AKIHIRO (JP)
IIDA TADASHI (JP)
IZUMI MASAHIRO (JP)

Application Number:

PCT/JP2016/052329

Publication Date:

August 03, 2017

Filing Date:

January 27, 2016

Export Citation:

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Assignee:

MITSUI HIGH-TEC INC (JP)

International Classes:

B21D28/02

Foreign References:

JP2007190570A	2007-08-02
JP2003289635A	2003-10-10
JP2008011664A	2008-01-17
JPH04197530A	1992-07-17

Other References: