Title:
METHOD FOR PROCESSING A SEMICONDUCTOR WAFER USING DOUBLE-SIDE POLISHING
Document Type and Number:
WIPO Patent Application WO2002011947
Kind Code:
A3
Abstract:
A method for polishing front and back surfaces of a semiconductor wafer includes the step of providing a polishing apparatus having a wafer carrier generally disposed between a first polishing pad and a second polishing pad. The first pad has a hardness significantly greater than a hardness of the second pad. The wafer is placed in the wafer carrier so that the front surface faces the first pad and so that the back surface faces the second pad. A polishing slurry is applied to at least one of the pads and the carrier, first pad and second pad are rotated. The front surface is brought into contact with the first pad and the back surface is brought into contact with the second pad for polishing the front and back surfaces of the wafer whereby less wafer material is removed from the back surface engaged by the second pad and the back surface has less gloss than the front surface after polishing so that the front surface and back surface are visually distinguishable.
Inventors:
ZHANG GUOQIANG D
ERK HENRY F
RAGAN TRACY M
KEARNS JULIE A
ERK HENRY F
RAGAN TRACY M
KEARNS JULIE A
Application Number:
PCT/US2001/021238
Publication Date:
April 25, 2002
Filing Date:
July 05, 2001
Export Citation:
Assignee:
MEMC ELECTRONIC MATERIALS (US)
International Classes:
B24B37/08; H01L21/304; H01L21/302; H01L21/306
Domestic Patent References:
| WO2000036637A1 | 2000-06-22 |
Foreign References:
| US5643405A | 1997-07-01 | |||
| US5873772A | 1999-02-23 | |||
| US5963821A | 1999-10-05 |
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