Title:
METHOD FOR PROCESSING SUBSTRATE FOR FILTER, AND SUBSTRATE AND TC-SAW FILTER
Document Type and Number:
WIPO Patent Application WO/2023/028906
Kind Code:
A1
Abstract:
Provided in the present application are a method for processing a substrate for a filter, and a substrate and a TC-SAW filter. The method for processing a substrate for a filter comprises: processing a support layer substrate having a convex concentric circle structure, wherein the convex concentric circle structure has a convex center and comprises at least two layers of circular ring structures, and the height of the circular ring structure gradually decreases from the center to the outside; bonding one side of the support layer substrate having the convex concentric circle structure with a piezoelectric wafer to obtain a composite substrate; and polishing a surface of the composite substrate after a piezoelectric layer in the composite substrate is thinned to within a predetermined thickness range. According to the present application, the support layer substrate with a convex concentric circle morphology is utilized, the polishing difficulty of the piezoelectric layer can be significantly reduced, and a piezoelectric layer substrate with a basically consistent thickness is obtained, so that a piezoelectric layer thin film with good uniformity is obtained, thereby greatly improving the yield of filter chips using the piezoelectric layer thin film.
Inventors:
LIN YENFU (CN)
LIN ZHONGHE (CN)
YANG SHENGYU (CN)
FANG MINGHUI (CN)
HUANG SHIHWEI (CN)
LIN ZHONGHE (CN)
YANG SHENGYU (CN)
FANG MINGHUI (CN)
HUANG SHIHWEI (CN)
Application Number:
PCT/CN2021/115877
Publication Date:
March 09, 2023
Filing Date:
September 01, 2021
Export Citation:
Assignee:
FUJIAN JINGAN OPTOELECTRONICS CO LTD (CN)
International Classes:
H03H9/02
Foreign References:
| CN108352442A | 2018-07-31 | |||
| CN111092148A | 2020-05-01 | |||
| CN104871431A | 2015-08-26 | |||
| JP2015159499A | 2015-09-03 | |||
| CN110957986A | 2020-04-03 |
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