Title:
METHOD FOR PROCESSING THIN CU PLATE
Document Type and Number:
WIPO Patent Application WO/2012/128025
Kind Code:
A1
Abstract:
A method for processing a thin Cu plate, wherein a buildup layer is formed by: applying a slurry, which is obtained by dispersing a diffusion bonding assistant and a reinforcing material in a solvent, onto a predetermined part of a thin plate that is formed of Cu or a Cu alloy; and fusion-bonding and affixing the thus-applied slurry to the predetermined part of the thin plate by irradiating the slurry with laser after drying the slurry. In this method for processing a thin Cu plate, (a) an Ni powder or an Ni-Cr alloy powder is used as the diffusion bonding assistant; (b) a carbide-based metal compound, a nitride-based metal compound or a boride-based metal compound is used as the reinforcing material with the weight ratio of the diffusion bonding assistant to the reinforcing material being from 80:20 to 50:50; and (c) the material for the diffusion bonding assistant and the material for the reinforcing material both have a median diameter (D50) of 0.1-100 μm, the median diameter (D50) of the material for the diffusion bonding assistant is larger than the median diameter (D50) of the material for the reinforcing material, and the distribution (D90/D10) of the material for the diffusion bonding assistant and the distribution (D90/D10) of the material for the reinforcing material are both 4.0 or less.
Inventors:
MURAMATSU NAOKUNI (JP)
AOSHIMA SHOJU (JP)
AOSHIMA SHOJU (JP)
Application Number:
PCT/JP2012/055649
Publication Date:
September 27, 2012
Filing Date:
March 06, 2012
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
MURAMATSU NAOKUNI (JP)
AOSHIMA SHOJU (JP)
MURAMATSU NAOKUNI (JP)
AOSHIMA SHOJU (JP)
International Classes:
C23C24/10; B23K26/32; B23K26/34; B23K35/30; B23K35/32; C22C9/00; C22C16/00; C22C19/05; C22C19/07; C22C29/06; C22C29/08; C22C29/10; C22C29/14
Foreign References:
| JP2003518193A | 2003-06-03 | |||
| JP2001049467A | 2001-02-20 | |||
| JP2008546909A | 2008-12-25 | |||
| JP2005254317A | 2005-09-22 | |||
| JPH01118397A | 1989-05-10 | |||
| JP2008534788A | 2008-08-28 | |||
| JPS60238487A | 1985-11-27 | |||
| JP2008214704A | 2008-09-18 | |||
| JPS61245988A | 1986-11-01 | |||
| JP2003518193A | 2003-06-03 | |||
| JP2008264842A | 2008-11-06 |
Other References:
ELECTRONIC MATERIALS MANUFACTURERS ASSOCIATION OF JAPAN STANDARD EMAS-3003, December 1991 (1991-12-01)
See also references of EP 2690196A4
See also references of EP 2690196A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Itec international patent firm (JP)
Patent business corporation Itec international patent firm (JP)
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Claims:
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