Title:
METHOD FOR PROCESSING WORKPIECES BY PUNCH-LASER COMBINATION MACHINE, AND PUNCH-LASER COMBINATION MACHINE
Document Type and Number:
WIPO Patent Application WO/2018/116789
Kind Code:
A1
Abstract:
A punch-laser combination machine comprises a punch and die for punching a flat workpiece, a laser processing head for laser processing a workpiece W, and a workpiece moving and positioning device for freely moving and positioning a workpiece with respect to the punch and die and the laser processing head in the x- and y-axis directions. In a method for processing workpieces with this punch-laser combination machine, the workpiece is punched in a state where the lower end of the laser processing head is rotated so as to be raised, and the workpiece is laser processed after the laser processing head is returned to the original state.
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Inventors:
HAJI SHIGEYUKI (JP)
Application Number:
PCT/JP2017/043330
Publication Date:
June 28, 2018
Filing Date:
December 01, 2017
Export Citation:
Assignee:
AMADA HOLDINGS CO LTD (JP)
International Classes:
B23P23/04; B21D28/36; B23K26/08; B23K26/10
Foreign References:
| JPH0523934A | 1993-02-02 | |||
| JP2007038286A | 2007-02-15 | |||
| JPH09277072A | 1997-10-28 | |||
| JPH1190660A | 1999-04-06 | |||
| JPH03281083A | 1991-12-11 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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