Title:
METHOD FOR PRODUCING ASSEMBLY, ASSEMBLY, AND ELECTROCONDUCTIVE-PARTICLE-CONTAINING HOT MELT ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2021/246483
Kind Code:
A1
Abstract:
Provided are a method for producing an assembly capable of obtaining exceptional adhesive strength and connection reliability, an assembly, and an electroconductive particle-containing hot melt adhesive sheet. A method for producing an assembly comprising thermocompression bonding a first electronic component (10) and a second electronic component (20) interposed by an electroconductive-particle-containing hot melt adhesive sheet containing solder particles in a binder that contains a crystalline polyamide resin having a carboxyl group, and connecting an part (11) that energizes the first electronic component (10) and a part (21) that energizes the second electronic component (20), wherein the melting point of the solder particles is from –30 to 0°C of the temperature of thermocompression bonding, and, when the melt viscosity of the electroconductive-particle-containing hot melt adhesive sheet is measured at a temperature elevation rate of 5°C/min, the ratio of the melt viscosity at –40°C of the temperature of thermocompression bonding to the melt viscosity at –20°C of the temperature of thermocompression bonding is 10 or higher.
Inventors:
KUMAKURA HIRORUKI (JP)
ABE TOMOYUKI (JP)
ABE TOMOYUKI (JP)
Application Number:
PCT/JP2021/021182
Publication Date:
December 09, 2021
Filing Date:
June 03, 2021
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J5/02; C09J5/06; C09J7/35; C09J9/02; C09J11/04; C09J11/06; C09J167/00; C09J177/00; H01B1/22; H01B5/16; H01R11/01; H01R43/00
Foreign References:
| JP2014017248A | 2014-01-30 | |||
| JP2014026963A | 2014-02-06 | |||
| JP2003031929A | 2003-01-31 | |||
| JPH0533017A | 1993-02-09 | |||
| JP2020033427A | 2020-03-05 | |||
| JP2018135422A | 2018-08-30 | |||
| JP2013140756A | 2013-07-18 | |||
| JP2020098844A | 2020-06-25 | |||
| JP2021093292A | 2021-06-17 | |||
| JP5964187B2 | 2016-08-03 | |||
| JP2017117468A | 2017-06-29 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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