METHOD FOR PRODUCING CARRIER AND METHOD FOR POLISHING WAFER

WIPO Patent Application WO/2019/044497

A1

Proposed are: a method for producing a carrier which is capable of suppressing deterioration of the planarity of a polished semiconductor wafer surface even in cases where double side polishing of a semiconductor wafer is performed repeatedly; and a method for polishing a wafer. The present invention is a method for producing a carrier that is provided with: a metal part which has a retaining hole for retaining a semiconductor wafer; and an annular resin part which is arranged along the inner wall that defines the retaining hole of the metal part, and which protects the outer peripheral portion of the semiconductor wafer. This method for producing a carrier comprises a preparation step (step S1) for preparing the metal part and the resin part, an arrangement step (step S2) for arranging the resin part within the retaining hole of the metal part, and a resin part polishing step (step S4) for polishing both surfaces of the resin part; and this method for producing a carrier is characterized by comprising, before the resin part polishing step (step S4), a swelling during manufacturing step (step S3) for swelling the resin part arranged within the retaining hole of the metal part by impregnating the resin part with a first liquid.

MIKURIYA SHUNSUKE (JP)
MIURA TOMONORI (JP)

PCT/JP2018/030303

March 07, 2019

August 14, 2018

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SUMCO CORP (JP)

H01L21/304; B24B37/28

JP2011025322A	2011-02-10
JPH0494122A	1992-03-26
JPH08236489A	1996-09-13
JPH1199471A	1999-04-13

SUGIMURA Kenji (JP)

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